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Texas Instruments: TMP006EVM Evaluation Module for the TMP006 Infrared Thermopile Sensor

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The Texas Instruments TMP006EVMTMP006EVM is a simple EVM designed to allow full evaluation of the TMP006AIYZFTTMP006AIYZFT device. The EVM features the TMP006TMP006 device with the required specific PCB layout and some simple support circuitry. The GUI for the EVM implements the full object temperature calculations allowing the user to measure object temperatures with the TMP006EVM.

 

The TMP006TMP006 is an infrared thermopile sensor with digital output integrated circuit. This device measures the temperature of an object without making contact, making it ideal for many types of applications. The TMP006EVMTMP006EVMis a platform for evaluating the performance of the TMP006AIYZFTTMP006AIYZFT under various conditions.

 

The TMP006EVMTMP006EVM consists of two PCBs:

  • One board, the SM-USB-DIG, communicates with the user’s computer, provides power, and sends and receives appropriate digital signals to communicate with the TMP006TMP006.
  • The second PCB, the TMP006AIYZFTTMP006AIYZFT_Test_Board, contains the TMP006 as well as support and configuration circuitry.

 

TMP006EVMTMP006EVM Hardware Setup:

The PC runs graphical user interface (GUI) software that communicates with the SM-USB-DIG over a USB connection. The SM-USB-DIG translates the USB commands from the PC into power, I2CTm, SPITm, and general-purpose input/output (GPIO) commands for the TMP006_Test_Board. The TMP006EVM does not require any additional components to operate.

 

Key Applications: Notebook Case Temperature, Comfort Index Measurement, Motor Case Temperature, Server Farm Power Management.

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Technical Documents

Learning Center

 

TypeDescription
User GuideTI: User Guide for TMP006EVM and Software Tutorial
User GuideTI: User Guide for TMP006
Selection GuideTI: Selection Guide for TI Solutions for Tablets and eBooks
DatasheetTI: Data Sheet for TMP006 - Infrared Thermopile Sensor in Chip-Scale Package
Reference ManualTI: Reference Guide for TMP006 Layout and Assembly Guidelines

 

Design Elements

 

TypeDescription
Application Library

TI: Software code for TMP006EVM (Rev. B)

Simulation ModelTI: TMP006 IBIS Model
CAD ModelTI: Footprints for TMP006AIYZFR
CAD ModelTI: Footprints for TMP006AIYZFT

 

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Kit Features

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Key Features for the TMP006EVMTMP006EVM Evaluation module are as below:

  • TMP006AIYZFTTMP006AIYZFT specific PCB layout
  • TMP006AIYZFTTMP006AIYZFT object temperature calculations
  • All required support circuitry
  • Extension cable for insertion into user's systems

 

Key features for TMP006TMP006 Infrared Thermopile Sensor:

  • Complete Solution in 1.6-mm × 1.6-mm Wafer Chip-Scale Package (WCSP) Device (DSBGA)
  • Digital Output:
    • Sensor Voltage: 7 μV/°C
    • Local Temperature: –40°C to +125°C
  • SMBus-Compatible Interface
  • Pin-Programable Interface Addressing
  • Low Supply Current: 240 μA
  • Low Minimum Supply Voltage: 2.2 V

 

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Kit Contents

 

The Texas Instruments TMP006EVMTMP006EVM TMP006AIYZFTTMP006AIYZFT Evaluation Module is supplied with below contents:

  • TMP006EVM test board
  • SM-USB-DIG platform controller
  • USB Extension Cable
  • Ribbon type extension cable
  • Software CDROM

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