I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
--
John Bachman, W1JGB
AnaTek Corporation
I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
--
John Bachman, W1JGB
AnaTek Corporation
John Bachman wrote on Thu, 12 August 2010 10:11
I am confused by the packages in the smd-ipc.lbr. For instance C0402
is 2.0 mm X 1.0 mm but the standard package for an 0402 capacitor
according to Kemet is 1.0 mm X 0.5 mm.
The name "0402" tells you directly that the package is nominally 40 x 20
mils, which is pretty close to 1 x 1/2 mm. Of course the PCB footprint is
going to be a bit bigger. If you make the pads 20 mils bigger than the
package at the ends and 10 mils on the sides, then you end up with a 80 x
40 footprint, which is pretty much what you reported.
--
Web access to CadSoft support forums at www.eaglecentral.ca. Where the CadSoft EAGLE community meets.
On 8/12/2010 10:11 AM, John Bachman wrote:
I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
Generally you would want the lands to be a little larger than the
component, if the lands were the same size as the termination faces of
the component you would not achieve proper solder fillets.
Good question though.
Ryan