I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
--
John Bachman, W1JGB
AnaTek Corporation
I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
--
John Bachman, W1JGB
AnaTek Corporation
On 8/12/2010 10:11 AM, John Bachman wrote:
I am confused by the packages in the smd-ipc.lbr. For instance C0402 is
2.0 mm X 1.0 mm but the standard package for an 0402 capacitor according
to Kemet is 1.0 mm X 0.5 mm.
Generally you would want the lands to be a little larger than the
component, if the lands were the same size as the termination faces of
the component you would not achieve proper solder fillets.
Good question though.
Ryan
John Bachman wrote on Thu, 12 August 2010 10:11
I am confused by the packages in the smd-ipc.lbr. For instance C0402
is 2.0 mm X 1.0 mm but the standard package for an 0402 capacitor
according to Kemet is 1.0 mm X 0.5 mm.
The name "0402" tells you directly that the package is nominally 40 x 20
mils, which is pretty close to 1 x 1/2 mm. Of course the PCB footprint is
going to be a bit bigger. If you make the pads 20 mils bigger than the
package at the ends and 10 mils on the sides, then you end up with a 80 x
40 footprint, which is pretty much what you reported.
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