Although I suppose I could design a device with non-overlapping SMD padsand a blob that joins them in a special layer, plus mods to the GerberULP to include that layer.
Although I suppose I could design a device with non-overlapping SMD pads
and a blob that joins them in a special layer, plus mods to the Gerber
ULP to include that layer.
That's what the devices in supply-dummy.lbr are for, I believe.
-- john, KE5FX
John Miles wrote:
That's what the devices in supply-dummy.lbr are for, I believe. -- john, KE5FX
I see no library called supply-dummy.lbr
On 1/19/08 3:18 PM, in article wxiyC5nRslkHFwSQ@daniel.huneausware.local,
"Robert Pearce" <news@bdt-home.demon.co.uk> wrote:
That is my preferred method. Its dangerous though because you are bypassing
DRC checking. But it gives you the lowest inductance path (which is
important) to connect together various parts of a ground plane.
I've been meaning to do a write up to explain how to do this. So many
things to do....
Cheers,
James.
--
James Morrison
www.eagletoolkit.com
Long-time EAGLE User and EAGLE Enterprise Toolkit Author
