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EAGLE User Chat (English) Advice on BGA device pad design , layout and routing...
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Advice on BGA device pad design , layout and routing...

autodeskguest
autodeskguest over 17 years ago

All,

 

I've been using through-hole and lately SMD devices extensively on one

and two layer boards, but I'm about to make my first foray into (what I

consider to be ) big BGA components and thats pushing me to 4 layers

(hopefully not higher) boards and more complexity.

 

So I'm looking for experienced viewpoints... since the excercies has

brought several questions up when I've been thinking about this...

 

- I have a 289 pin MAPBGA device (a freescale i.MX21 processor), that

I've created a footprint for , its a 0.8mm pitch part (there is a 0.65mm

version too... yikes), the pad layout seems pretty straightforward,

there is a 7x7 central cluster of pads, surrounded by a 2 pad space then

a 4 deep row of pads around the periphery of the chip.

 

- the recommendations for solder mask seem to be make the mask slightly

smaller than the pads (, balls = 30mil diameter, pads=30mil, mask=25mil)

to encourage good reflow of the solder balls.

 

- Next comes the routing and layout of the board..., can I create a

package with pads in a figure 8 shape (sometimes called dog-bone),  one

end being the pad the other being a via to one of the four layers of my

board or a simple connection to this layer and out to the rest of the board.

 

- I think I can get away with a 4 layer board, 4 layers should be enough

for me to route all the pins I need, BUT... will the board houses allow

me to put a bunch of signals on the two internal layers that they seem

to expect are power supply and ground planes..., is this just

terminology/convention or is there a real limitation here. I'd be

bringing those signals up or down to the conventional two layers as soon

as practical but there won't be ONLY VCC and GND on those middle layers

 

- Most of these signals are fairly low frequency, apart from the LCD TFT

driver signals...  so hopefully I won;t run into layout issues for

signa/noise problems.

 

- I really don't want to have to think about a 6 layer design since that

means a more expensive Eagle license and a more expensive board

manufacturing cost.. this is all hobby based stuff..

 

I'm calling for the voice of experience with this and any related issues

you've run into ....

 

 

 

 

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  • autodeskguest
    autodeskguest over 17 years ago

    Matthias Weisser wrote:

    Bert Menkveld schrieb:

    all the proper equipment they had (including X-ray inspection).  I

    don't think BGA assembly is suited for hobbyist DIY assembly.  Are you

    sure you

     

    Do you know http://www.lrr.in.tum.de/~acher/bga/index.html? It is in

    German but maybe you get an idea of how to solder a BGA with an electric

    iron and some other simple stuff most of us have at home.

     

     

    Google has a reasonable attempt at translating the site, but there is

    definitely some guess work to be done after the translation image

     

    The referenced Motorola App Note if very good, I'll be using that as a

    reference.

     

    I've not tried this yet, but my experience with using solder paste on my

    boards with surface mount parts has been exceptionally good, dabbing a

    little paste from a modellers glue dispenser (syringe with small needle)

    on the pads, placing the component with tweezers on the pasted pad

    populating the SMD parts tyhis way then putting the whole aseembly

    (carefully) into a toaster oven (with a fan to circulate the air to

    reduce hotspots) , cranking the heat to 240 Centigrade and back down.

     

    The discrete SMD's look very professionally soldered, the whole board

    looks clean and finished with no extra work, and I've never had a

    problem with them, some of the higher pin density SOIC type devices may

    bridge between pins if I applied too much paste, but its easily fixed by

    a little solder wick and application of a soldering iron to the affected

    pins.

     

    My reading up on this says the same principles apply with BGA devices,

    with the exception that bridges can't be fixed... its a one chance deal.

    SO... the recommendation appears to be apply the very small amount of

    paste(or even just flux) by using an appropriate stencil (perhaps for

    just the BGA, but why not the whole board kits can be had fairly cheap

    now, this gets you just the the right amount of paste onto the pads

    through the stencil holes...careful placement of the BGA and then a

    better controlled heating /cooling cycle should have the desired effect.

     

    Once I get my board routed I'll be able to tell you if it works... I do

    envisage a steep learning curve, I have three processors to work with,

    at $20 each I can afford to learn from a couple of mistakes.

     

    Peter

     

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  • autodeskguest
    autodeskguest over 17 years ago

    Matthias Weisser wrote:

    Bert Menkveld schrieb:

    all the proper equipment they had (including X-ray inspection).  I

    don't think BGA assembly is suited for hobbyist DIY assembly.  Are you

    sure you

     

    Do you know http://www.lrr.in.tum.de/~acher/bga/index.html? It is in

    German but maybe you get an idea of how to solder a BGA with an electric

    iron and some other simple stuff most of us have at home.

     

     

    Google has a reasonable attempt at translating the site, but there is

    definitely some guess work to be done after the translation image

     

    The referenced Motorola App Note if very good, I'll be using that as a

    reference.

     

    I've not tried this yet, but my experience with using solder paste on my

    boards with surface mount parts has been exceptionally good, dabbing a

    little paste from a modellers glue dispenser (syringe with small needle)

    on the pads, placing the component with tweezers on the pasted pad

    populating the SMD parts tyhis way then putting the whole aseembly

    (carefully) into a toaster oven (with a fan to circulate the air to

    reduce hotspots) , cranking the heat to 240 Centigrade and back down.

     

    The discrete SMD's look very professionally soldered, the whole board

    looks clean and finished with no extra work, and I've never had a

    problem with them, some of the higher pin density SOIC type devices may

    bridge between pins if I applied too much paste, but its easily fixed by

    a little solder wick and application of a soldering iron to the affected

    pins.

     

    My reading up on this says the same principles apply with BGA devices,

    with the exception that bridges can't be fixed... its a one chance deal.

    SO... the recommendation appears to be apply the very small amount of

    paste(or even just flux) by using an appropriate stencil (perhaps for

    just the BGA, but why not the whole board kits can be had fairly cheap

    now, this gets you just the the right amount of paste onto the pads

    through the stencil holes...careful placement of the BGA and then a

    better controlled heating /cooling cycle should have the desired effect.

     

    Once I get my board routed I'll be able to tell you if it works... I do

    envisage a steep learning curve, I have three processors to work with,

    at $20 each I can afford to learn from a couple of mistakes.

     

    Peter

     

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