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Autodesk EAGLE
EAGLE User Chat (English) Advice on BGA device pad design , layout and routing...
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Advice on BGA device pad design , layout and routing...

autodeskguest
autodeskguest over 17 years ago

All,

 

I've been using through-hole and lately SMD devices extensively on one

and two layer boards, but I'm about to make my first foray into (what I

consider to be ) big BGA components and thats pushing me to 4 layers

(hopefully not higher) boards and more complexity.

 

So I'm looking for experienced viewpoints... since the excercies has

brought several questions up when I've been thinking about this...

 

- I have a 289 pin MAPBGA device (a freescale i.MX21 processor), that

I've created a footprint for , its a 0.8mm pitch part (there is a 0.65mm

version too... yikes), the pad layout seems pretty straightforward,

there is a 7x7 central cluster of pads, surrounded by a 2 pad space then

a 4 deep row of pads around the periphery of the chip.

 

- the recommendations for solder mask seem to be make the mask slightly

smaller than the pads (, balls = 30mil diameter, pads=30mil, mask=25mil)

to encourage good reflow of the solder balls.

 

- Next comes the routing and layout of the board..., can I create a

package with pads in a figure 8 shape (sometimes called dog-bone),  one

end being the pad the other being a via to one of the four layers of my

board or a simple connection to this layer and out to the rest of the board.

 

- I think I can get away with a 4 layer board, 4 layers should be enough

for me to route all the pins I need, BUT... will the board houses allow

me to put a bunch of signals on the two internal layers that they seem

to expect are power supply and ground planes..., is this just

terminology/convention or is there a real limitation here. I'd be

bringing those signals up or down to the conventional two layers as soon

as practical but there won't be ONLY VCC and GND on those middle layers

 

- Most of these signals are fairly low frequency, apart from the LCD TFT

driver signals...  so hopefully I won;t run into layout issues for

signa/noise problems.

 

- I really don't want to have to think about a 6 layer design since that

means a more expensive Eagle license and a more expensive board

manufacturing cost.. this is all hobby based stuff..

 

I'm calling for the voice of experience with this and any related issues

you've run into ....

 

 

 

 

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  • autodeskguest
    autodeskguest over 17 years ago

    peter wrote:

    Matthias Weisser wrote:

     

    my experience with using solder paste on my

    boards with surface mount parts has been exceptionally good, dabbing a

    little paste from a modellers glue dispenser (syringe with small needle)

    on the pads, placing the component with tweezers on the pasted pad

    populating the SMD parts tyhis way then putting the whole aseembly

    (carefully) into a toaster oven (with a fan to circulate the air to

    reduce hotspots) , cranking the heat to 240 Centigrade and back down.

     

    It you ever need, there exist brass sheet with photo resist so you can

    etch your own pasta stencil.

     

    IIRC http://www1.business.conrad.de have them.

     

    Or maybe your board house can make one.

     

    The discrete SMD's look very professionally soldered, the whole board

    looks clean and finished with no extra work, and I've never had a

    problem with them, some of the higher pin density SOIC type devices may

    bridge between pins if I applied too much paste, but its easily fixed by

    a little solder wick and application of a soldering iron to the affected

    pins.

     

    I have gotten up to speed on prototype series using a good 0,25 mm lead

    free solder on my normal 0603 and SOIC.  The 0,5mm spacing pins i solder

    over all, then wick it back.

     

    For the few SMT resistor nets with pads underneath i have used solder

    paste and a cheap hot air solder gun, also from Conrad.

     

    For one-off BGA i think my personal take would be to cut a big hole in

    the board and solder thin enamelled wires for the signals and some mesh

    for GND and then decoupling caps "on top" of that... mess... image

     

    I have hand routed a pretty dense SOIC prototype using thin enameled

    wires only.  In this case yoi really need good solder, wire and solder

    iron, and plan the work moving soldering from one side to the other in

    sequence...

     

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  • autodeskguest
    autodeskguest over 17 years ago

    peter wrote:

    Matthias Weisser wrote:

     

    my experience with using solder paste on my

    boards with surface mount parts has been exceptionally good, dabbing a

    little paste from a modellers glue dispenser (syringe with small needle)

    on the pads, placing the component with tweezers on the pasted pad

    populating the SMD parts tyhis way then putting the whole aseembly

    (carefully) into a toaster oven (with a fan to circulate the air to

    reduce hotspots) , cranking the heat to 240 Centigrade and back down.

     

    It you ever need, there exist brass sheet with photo resist so you can

    etch your own pasta stencil.

     

    IIRC http://www1.business.conrad.de have them.

     

    Or maybe your board house can make one.

     

    The discrete SMD's look very professionally soldered, the whole board

    looks clean and finished with no extra work, and I've never had a

    problem with them, some of the higher pin density SOIC type devices may

    bridge between pins if I applied too much paste, but its easily fixed by

    a little solder wick and application of a soldering iron to the affected

    pins.

     

    I have gotten up to speed on prototype series using a good 0,25 mm lead

    free solder on my normal 0603 and SOIC.  The 0,5mm spacing pins i solder

    over all, then wick it back.

     

    For the few SMT resistor nets with pads underneath i have used solder

    paste and a cheap hot air solder gun, also from Conrad.

     

    For one-off BGA i think my personal take would be to cut a big hole in

    the board and solder thin enamelled wires for the signals and some mesh

    for GND and then decoupling caps "on top" of that... mess... image

     

    I have hand routed a pretty dense SOIC prototype using thin enameled

    wires only.  In this case yoi really need good solder, wire and solder

    iron, and plan the work moving soldering from one side to the other in

    sequence...

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
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