I know that the default solder mask and cream stencil openings are
the same size as the smd pad. However, in some cases, (such as on page
85 of this datasheet:
http://focus.ti.com/lit/ds/symlink/msp430f2274.pdf) the solder mask is
greater than the pad and the cream stencil is smaller.
Can someone please explain why is it done that way and can the default
eagle settings be used or would it create a problem?