element14 Community
element14 Community
    Register Log In
  • Site
  • Search
  • Log In Register
  • Community Hub
    Community Hub
    • What's New on element14
    • Feedback and Support
    • Benefits of Membership
    • Personal Blogs
    • Members Area
    • Achievement Levels
  • Learn
    Learn
    • Ask an Expert
    • eBooks
    • element14 presents
    • Learning Center
    • Tech Spotlight
    • STEM Academy
    • Webinars, Training and Events
    • Learning Groups
  • Technologies
    Technologies
    • 3D Printing
    • FPGA
    • Industrial Automation
    • Internet of Things
    • Power & Energy
    • Sensors
    • Technology Groups
  • Challenges & Projects
    Challenges & Projects
    • Design Challenges
    • element14 presents Projects
    • Project14
    • Arduino Projects
    • Raspberry Pi Projects
    • Project Groups
  • Products
    Products
    • Arduino
    • Avnet & Tria Boards Community
    • Dev Tools
    • Manufacturers
    • Multicomp Pro
    • Product Groups
    • Raspberry Pi
    • RoadTests & Reviews
  • About Us
  • Store
    Store
    • Visit Your Store
    • Choose another store...
      • Europe
      •  Austria (German)
      •  Belgium (Dutch, French)
      •  Bulgaria (Bulgarian)
      •  Czech Republic (Czech)
      •  Denmark (Danish)
      •  Estonia (Estonian)
      •  Finland (Finnish)
      •  France (French)
      •  Germany (German)
      •  Hungary (Hungarian)
      •  Ireland
      •  Israel
      •  Italy (Italian)
      •  Latvia (Latvian)
      •  
      •  Lithuania (Lithuanian)
      •  Netherlands (Dutch)
      •  Norway (Norwegian)
      •  Poland (Polish)
      •  Portugal (Portuguese)
      •  Romania (Romanian)
      •  Russia (Russian)
      •  Slovakia (Slovak)
      •  Slovenia (Slovenian)
      •  Spain (Spanish)
      •  Sweden (Swedish)
      •  Switzerland(German, French)
      •  Turkey (Turkish)
      •  United Kingdom
      • Asia Pacific
      •  Australia
      •  China
      •  Hong Kong
      •  India
      •  Korea (Korean)
      •  Malaysia
      •  New Zealand
      •  Philippines
      •  Singapore
      •  Taiwan
      •  Thailand (Thai)
      • Americas
      •  Brazil (Portuguese)
      •  Canada
      •  Mexico (Spanish)
      •  United States
      Can't find the country/region you're looking for? Visit our export site or find a local distributor.
  • Translate
  • Profile
  • Settings
Autodesk EAGLE
  • Products
  • More
Autodesk EAGLE
EAGLE User Chat (English) multi symbol device from a previously single symbol device
  • Blog
  • Forum
  • Documents
  • Events
  • Polls
  • Files
  • Members
  • Mentions
  • Sub-Groups
  • Tags
  • More
  • Cancel
  • New
Join Autodesk EAGLE to participate - click to join for free!
Actions
  • Share
  • More
  • Cancel
Forum Thread Details
  • Replies 2 replies
  • Subscribers 177 subscribers
  • Views 364 views
  • Users 0 members are here
Related

multi symbol device from a previously single symbol device

autodeskguest
autodeskguest over 16 years ago

Hi All,

 

I'm struggling to split the symbol on a device I created, its a many pin

processor which i originally designed as a device with one package and

one symbol, I'd now like to split that symbol onto a few different

functional pages of my schematics (power, memory, IO devices, etc),

instead of having one massive symbol with all of the pins and no room to

actually draw the schamatic.

 

I'd like to split it into several sub symbols that I can place on

different sheets of my design that are more related to power, memory, io

devices, etc..

 

This is a 300 pin BGA package and i've spent a lot of time and effort

making sure that the pin to pad mapping is correct with my current mega

symbol, is there any way I can create additional symbols for the part

and cut pins from the mega symbol to the relevant function symbol while

still maintaining the mapping of pin to pad number ?

 

Any help appreciated.

 

Peter

 

  • Sign in to reply
  • Cancel
  • Richard_H
    Richard_H over 16 years ago

    peter schrieb:

    Hi All,

     

    I'm struggling to split the symbol on a device I created, its a many pin

    processor which i originally designed as a device with one package and

    one symbol, I'd now like to split that symbol onto a few different

    functional pages of my schematics (power, memory, IO devices, etc),

    instead of having one massive symbol with all of the pins and no room to

    actually draw the schamatic.

     

    I'd like to split it into several sub symbols that I can place on

    different sheets of my design that are more related to power, memory, io

    devices, etc..

     

    This is a 300 pin BGA package and i've spent a lot of time and effort

    making sure that the pin to pad mapping is correct with my current mega

    symbol, is there any way I can create additional symbols for the part

    and cut pins from the mega symbol to the relevant function symbol while

    still maintaining the mapping of pin to pad number ?

     

    Any help appreciated.

     

    Peter

     

    First step is to divide the symbol into several new symbols with

    GROUP, CUT and PASTE. Create a new device then and add the package.

    Now RUn split-device-symbol.ulp. It compares the pin-pad connections

    of the old device with the pin names of the symbols in the new device

    and executes the CONNECT command then.

    A description how the ULP works is in the ULP.

     

     

    --

    Mit freundlichen Gruessen / Best regards

    Richard Hammerl

    CadSoft Support -- hotline@cadsoft.de

    FAQ: http://www.cadsoft.de/faq.htm

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
  • autodeskguest
    autodeskguest over 16 years ago

    Richard Hammerl wrote:

    peter schrieb:

    Hi All,

     

    I'm struggling to split the symbol on a device I created, its a many pin

    processor which i originally designed as a device with one package and

    one symbol, I'd now like to split that symbol onto a few different

    functional pages of my schematics (power, memory, IO devices, etc),

    instead of having one massive symbol with all of the pins and no room to

    actually draw the schamatic.

     

    I'd like to split it into several sub symbols that I can place on

    different sheets of my design that are more related to power, memory, io

    devices, etc..

     

    This is a 300 pin BGA package and i've spent a lot of time and effort

    making sure that the pin to pad mapping is correct with my current mega

    symbol, is there any way I can create additional symbols for the part

    and cut pins from the mega symbol to the relevant function symbol while

    still maintaining the mapping of pin to pad number ?

     

    Any help appreciated.

     

    Peter

     

    First step is to divide the symbol into several new symbols with

    GROUP, CUT and PASTE. Create a new device then and add the package.

    Now RUn split-device-symbol.ulp. It compares the pin-pad connections

    of the old device with the pin names of the symbols in the new device

    and executes the CONNECT command then.

    A description how the ULP works is in the ULP.

     

     

     

    Excellent, that did exactly what I wanted, thank you so much...

     

    I had a couple of false starts with not knowing exactly what the script

    wanted but once I figured that out, it just did exactly what I wanted it

    to do.

     

    The software and the scripts in combination with this group make for an

    excellent piece of software.. even more glad I spent the money now.

     

     

    Peter

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
element14 Community

element14 is the first online community specifically for engineers. Connect with your peers and get expert answers to your questions.

  • Members
  • Learn
  • Technologies
  • Challenges & Projects
  • Products
  • Store
  • About Us
  • Feedback & Support
  • FAQs
  • Terms of Use
  • Privacy Policy
  • Legal and Copyright Notices
  • Sitemap
  • Cookies

An Avnet Company © 2025 Premier Farnell Limited. All Rights Reserved.

Premier Farnell Ltd, registered in England and Wales (no 00876412), registered office: Farnell House, Forge Lane, Leeds LS12 2NE.

ICP 备案号 10220084.

Follow element14

  • X
  • Facebook
  • linkedin
  • YouTube