I am adding a test connector, with contacts made between board pads and
spring loaded pins. To ensure pads will make good electrical contact,
the manufacturer cautions the "past-mask layer" be corrected defined.
I find no reference to that name in the EAGLE manual.
Does it have another name?
How can I be sure the contact pads will be solder paste free?
CAE/CAD packages usually assume that pads with no through holes are for
surface mounted components and solder paste is deposited on them by default!
To resolve this, edit the pad-stack in your CAE/CAD software, show the
paste-mask layer and set the pad size to zero for that layer.