Is it possible to create a testpad device such that when it is added as
a symbol to the schematic a package is created in the PCB consisting of
a single square test pad on the bottom side with its origin on borigins?
I don't want to have to use the mirror command on the PCB.
I can almost do this but it involves either having the bottom pad origin
in torigins or requiring the mirror command to be used.
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