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Single Pad help

e14 Contributor

I am using eagle light. I am trying to create a package that has a normal pad on one side of the board, but a smaller pad on the other.  I see that I can change the restring settings in the design rules but I dont want it to apply to all pads on the board as there are other parts that need the full pad.  Can anyone point me in the right direction on how to accomplish this? 

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  • I'm new to EAGLE myself, but this looks like it will work. When you create your pad, create it normally using the pad tool with the settings adjusted for the smaller pad. After that, use the circle tool, adjusting the line width and grid to draw the larger pad over the smaller one. When drawing the larger pad, select the layer (top or bottom) in which to draw. Like I said, I'm new to EAGLE so this might or might not work.

     

    One other thing I noticed was the solder mask on my test part was not covering the larger pad. Since the pad was round, a chose the circle tool and set the width of the line to 0. Changed the layer to tstop and covered the new larger pad with the circle.

     

    Message was edited by: Richard Blackburn

  • in reply to e14 Contributor

    On 16/01/2012 02:28, Richard Blackburn wrote:

    I'm new to EAGLE myself, but this looks like it will work. When you

    create your pad, create it normally using the pad tool with the

    settings adjusted for the smaller pad. After that, use the circle

    tool, adjusting the line width and grid to draw the larger pad over

    the smaller one. When drawing the larger pad, select the layer (top

    or bottom) in which to draw. Like I said, I'm new to EAGLE so this

    might or might not work.

     

     

    This makes sense but as well as 'enlarging' the pad by drawing a copper

    circle you may also wish to draw a slightly larger circle in the tStop

    (or bStop) layer.  This will ensure the enlarged pad is not covered by

    solder resist, if the board will be produced with it.

     

     

    Andrew

    0xADF

     

  • in reply to e14 Contributor

    Thank you guys, this really helped.  It turns out that I don't have enough clearance to put a small pad on the one side of the board and need to do a non-plated through hole.  I created the copper, mask and hole on the package but now I cannot assign it to a device because there aren't any "pads" associated with the package.  any idea on how to create a non-plated through hole?

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  • in reply to e14 Contributor

    Thank you guys, this really helped.  It turns out that I don't have enough clearance to put a small pad on the one side of the board and need to do a non-plated through hole.  I created the copper, mask and hole on the package but now I cannot assign it to a device because there aren't any "pads" associated with the package.  any idea on how to create a non-plated through hole?

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  • in reply to e14 Contributor

    Bryan T wrote:

    Thank you guys, this really helped. It turns out that I don't have

    enough clearance to put a small pad on the one side of the board and

    need to do a non-plated through hole. I created the copper, mask and

    hole on the package but now I cannot assign it to a device because

    there aren't any "pads" associated with the package. any idea on how

    to create a non-plated through hole?

     

    Make your Top copper pad a SMD with 100% roundness. That will give you a

    circular pad. An advantage is that the stop and cream are automatic if

    needed.

    Then add a HOLE of the desired size in the centre of the round SMD. True

    unplated holes are drilled last in the process so will not be plated

    through.

    You will get one DRC 'dimension', error which you approve.

     

    HTH

    Warren

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