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Question about ground copper pour and manually created ground trace

Former Member

Hi everybody,

 

I have a question.

Is there any way in Eagle (5.11) I could create a polygon copper pour for GND but in the same time have a few other (2) separate GND traces , creted manually and not part of the polygon, that connecect to the GND copper pour in a point (on the same layer of the pcb).

I am not sure I explained this correctly but any help is welcomed.

What I am trying to do is to create a copper pour for GND on the entire layer, but in the same time I would like to exclude from the copper pour a few traces (the ones that come from the capacitors of the crystall oscillator). The excluded traces are connected together and then connected to the ground copper pour.

How can this be done?

The board is goning to be a double sided board.

 

Thank you,

 

Buzai

  • Buzai Andras wrote:

    Hi everybody,

     

    I have a question.

    Is there any way in Eagle (5.11) I could create a polygon copper pour

    for GND but in the same time have a few other (2) separate GND traces

    , creted manually and not part of the polygon, that connecect to the

    GND copper pour in a point (on the same layer of the pcb).

    I am not sure I explained this correctly but any help is welcomed.

    What I am trying to do is to create a copper pour for GND on the

    entire layer, but in the same time I would like to exclude from the

    copper pour a few traces (the ones that come from the capacitors of

    the crystall oscillator). The excluded traces are connected together

    and then connected to the ground copper pour. How can this be done?

    The board is goning to be a double sided board.

     

    Thank you,

     

    Buzai

     

    A common ask.. The standard technique is to have  seperated grounds having

    different names and connect them at the star point with a link

    device/package.

     

    For a small design or for small areas like the xtal caps you cam overlay

    tRestrict wires that are wider by the required amount over the traces that

    should not connect to the pour.  Be careful near thermals so that the spokes

    do not withdraw from the pads

     

    HTH

    Warren

     

    --

    Viewed / responded via the newsgroup at

    news.cadsoft.de

     

     

     

  • in reply to Former Member

    Thank you for your reply.

    I have one more question.

    How can I create a link device/package? I am a beginner with Eagle.

    I know how to create a package for a new component but I am not sure I know how to create a link device/package.

    Do you have a example package? Or is there a package of this kind included in the Eagle libraries?

    It may be a simple answer but I am not really sure how this link package should be implemented.

     

    Thank you for your help,

     

    Buzai