I have some rather thick traces (for high current), but where they connect
to the through hole pad they have a lot of rounding that makes them
overshoot the component via & get close to the adjacent pad. Is there a
way to make the ending a bit more "blunt", I'd like the trace ending to be
"flatter" at the via & not overshoot the pad so much.
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Hi Norm,
I've had the same issue in the past. The only way I know is to just reduce the track thickness manually (see example image below), as you
approach very close to the pad.
Ideally, it would be good if EAGLE would automatically reduce the thickness, and have a way not to cause a DRC error (since typically, the
thick tracks would have a class) as long as the track is only thin to within x mil (i.e. it should be configurable) distance of the pad.
Note: this is with v5, perhaps v6 has an enhancement in this area.
You can see a type of example here (which is a partially laid out board). In this case, the fat tracks were not for current
capability but for controlled impedance, but I need to make them narrower as they approach close to the pads, otherwise they would not fit.
Hi Norm,
I've had the same issue in the past. The only way I know is to just reduce the track thickness manually (see example image below), as you
approach very close to the pad.
Ideally, it would be good if EAGLE would automatically reduce the thickness, and have a way not to cause a DRC error (since typically, the
thick tracks would have a class) as long as the track is only thin to within x mil (i.e. it should be configurable) distance of the pad.
Note: this is with v5, perhaps v6 has an enhancement in this area.
You can see a type of example here (which is a partially laid out board). In this case, the fat tracks were not for current
capability but for controlled impedance, but I need to make them narrower as they approach close to the pads, otherwise they would not fit.
