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How do you make custom shape pads in Eagle?

Thanks,

Doug

May I simply quote from the manual...

8.14 Arbitrary Pad Shapes
If you have to define a package with solder areas that can't be achieved with the default pad shapes, you have to draw an arbitrary pad shape. This can be done with the help of a polygon or with additional wires. As soon as the center of the pad or SMD is inside the polygon's area or a wire begins at the center of a pad, it is recognized as a part of the PAD/SMD.
The typical way to draw an arbitrary pads shape is:
 Place a PAD or SMD
 Use POLYGON to draw the final pad shape
For a SMD typically in Layer Top
For a PAD you have to draw the final shape in all the layers you plan to use (Top, Bottom, Inner layers...)
The PAD/SMDs center must be inside the polygon's area. Otherwise that polygon is not recognized as a part to the pad. Use a reasonablewire width for the polygon, which fulfils the Design Rules.
 The alternative to POLYGON is WIRE
Start the wire in the origin of the PAD/SMD. You have to draw this area in any signal layer you plan to use. Please use a reasonable wire width, which fits to the Design Rules.
 Check the solder stop mask

Mask data will be generated for the PAD/SMD area only. Display layers 29, tStop and 30, bStop. If you want to have the area not
covered by solder stop lacquer, draw it manually in the appropriatelayer(s).
 Check the cream frame (solder paste mask)
Display layers 31, tCream and 32, bCream for this. As we agreed upon defining packages always on the top side of a board, the layer we have to check is 31, tCream. Mask data will be generated automatically for the SMD area only. If this is not what you would
like to have, simply draw the mask manually. Keep in mind that it ispossible to switch off automatic generation of mask data in the SMD properties (Cream on/off).
Further conditions for drawing arbitrary pad shapes can be found in the helpfunction about the PAD or SMD command.

Regards,

Richard

May I simply quote from the manual...

8.14 Arbitrary Pad Shapes
If you have to define a package with solder areas that can't be achieved with the default pad shapes, you have to draw an arbitrary pad shape. This can be done with the help of a polygon or with additional wires. As soon as the center of the pad or SMD is inside the polygon's area or a wire begins at the center of a pad, it is recognized as a part of the PAD/SMD.
The typical way to draw an arbitrary pads shape is:
 Place a PAD or SMD
 Use POLYGON to draw the final pad shape
For a SMD typically in Layer Top
For a PAD you have to draw the final shape in all the layers you plan to use (Top, Bottom, Inner layers...)
The PAD/SMDs center must be inside the polygon's area. Otherwise that polygon is not recognized as a part to the pad. Use a reasonablewire width for the polygon, which fulfils the Design Rules.
 The alternative to POLYGON is WIRE
Start the wire in the origin of the PAD/SMD. You have to draw this area in any signal layer you plan to use. Please use a reasonable wire width, which fits to the Design Rules.
 Check the solder stop mask

Mask data will be generated for the PAD/SMD area only. Display layers 29, tStop and 30, bStop. If you want to have the area not
covered by solder stop lacquer, draw it manually in the appropriatelayer(s).
 Check the cream frame (solder paste mask)
Display layers 31, tCream and 32, bCream for this. As we agreed upon defining packages always on the top side of a board, the layer we have to check is 31, tCream. Mask data will be generated automatically for the SMD area only. If this is not what you would
like to have, simply draw the mask manually. Keep in mind that it ispossible to switch off automatic generation of mask data in the SMD properties (Cream on/off).
Further conditions for drawing arbitrary pad shapes can be found in the helpfunction about the PAD or SMD command.

Regards,

Richard