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Led Engin layout

Former Member

Hi,

 

I'm new to designing footprints and I'm working on the layout for the LED Engin LZ1-00U600. I'm having trouble figuring out how to design the solder pad layout for the thermal pad of this LED. I'm attaching a picture of the layout provided on the datasheet. Can anyone guide me on how to do the central disk of this footprint?

 

Thank you.

 

image

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  • The datasheet that I have comes from here: http://www.ledengin.com/files/products/LZ1/LZ1-00U600.pdf

    I checked the one on Farnell and I believe it's the same one though.

     

    I was planning on an FR4 PCB. I'm still very confused on how to make the layout for this emitter. Is the datasheet wrong then?

     

    Thank you.

  • in reply to Former Member

    Interesting - I googled the part number and got  a link to Farnell part number 1901493 which has a similar but different data sheet.


    I think the footprint on the data sheet you have is probably intended for ceramic clad metal substrates and will not be good for FR4. Either talk to the manufacturers of the part or get ready to do experiments. The data sheet (either of them) does not, in my opinion, give a footprint suitable for FR4 and full power operation. (Now I see your actual data sheet there isn't a hole in the pad at all so all the heat will need to flow through the fibreglass board -  the LED will fry.)


    If you check up on some surface mount power devices you will be able to get an idea of the sort of techniques commonly used to get low thermal resistance from chip to ambient.


    MK



     

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  • in reply to Former Member

    Interesting - I googled the part number and got  a link to Farnell part number 1901493 which has a similar but different data sheet.


    I think the footprint on the data sheet you have is probably intended for ceramic clad metal substrates and will not be good for FR4. Either talk to the manufacturers of the part or get ready to do experiments. The data sheet (either of them) does not, in my opinion, give a footprint suitable for FR4 and full power operation. (Now I see your actual data sheet there isn't a hole in the pad at all so all the heat will need to flow through the fibreglass board -  the LED will fry.)


    If you check up on some surface mount power devices you will be able to get an idea of the sort of techniques commonly used to get low thermal resistance from chip to ambient.


    MK



     

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