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LT3759 exposed Pad

nikoly

I'm using a 2 Layer Board in Eagle .

The datasheet gives some info about the layout, advising me to add some  vias inside that Pad for heatsink problems.

I have opened Eagle tutorial "ti-launchpad" where there are  2 IC with Pads and vias on them (how in the image)p .image

Watching the DRC I have some overlap errors.

I can follow that way in order to design my board but I wonder if it's the right way to do this or not !

I have also seen someone to put arrays of pads instead of vias in order to get this!

 

Hope you can put me in the right direction!

Thanks a lot

Nico

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    Hi Nico,

     

    I've seen people say all sorts of things about the way to deal with this but to be honest just placing vias in the pad and approving all the resulting DRC errors seems the simplest way forward to me and I have done it this way plenty of times without issue. The only problem is if you move the IC and vias the DRC approvals need to be done again.

     

    When placing vias in the pad like this you do need to be careful of the drill size. If the via is too large then the solder will get wicked away from under the IC when it's reflowed. With more complicated boards you can use a combination if microvias and buried vias to eliminate the solder wicking away problem but for standard boards with just through vias then just make sure the drill size for this is small enough to reduce the risk.

     

    I think usually they are expecting that these devices are placed on multi layer boards with a solid 0V plane which doubles as a heat sink to take the heat away into the surrounding board. With a 2-layer board you wont have as much heat dissipation from this method so you might need to keep an eye on the device temperature when getting your board up and running. Also be aware that when building boards like this then the manufacturer who is assembling your board needs to know there are heatsink structures on these thermal pads so they can adjust their temperature profiles to ensure enough heat gets into the board so the thermal pad reflows properly.

     

    Best Regards,


    Rachael

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  • 0

    Hi Nico,

     

    I've seen people say all sorts of things about the way to deal with this but to be honest just placing vias in the pad and approving all the resulting DRC errors seems the simplest way forward to me and I have done it this way plenty of times without issue. The only problem is if you move the IC and vias the DRC approvals need to be done again.

     

    When placing vias in the pad like this you do need to be careful of the drill size. If the via is too large then the solder will get wicked away from under the IC when it's reflowed. With more complicated boards you can use a combination if microvias and buried vias to eliminate the solder wicking away problem but for standard boards with just through vias then just make sure the drill size for this is small enough to reduce the risk.

     

    I think usually they are expecting that these devices are placed on multi layer boards with a solid 0V plane which doubles as a heat sink to take the heat away into the surrounding board. With a 2-layer board you wont have as much heat dissipation from this method so you might need to keep an eye on the device temperature when getting your board up and running. Also be aware that when building boards like this then the manufacturer who is assembling your board needs to know there are heatsink structures on these thermal pads so they can adjust their temperature profiles to ensure enough heat gets into the board so the thermal pad reflows properly.

     

    Best Regards,


    Rachael

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  • 0 in reply to rachaelp

    Hi Rachael ,

    thanks for the reply.

    I 've also immagined that this kind of IC requires a minimum 4 layers board in order to benefit from the exposed pad presence but since its the first time I needed an advice on this issue.

     

    Reading this tutorial (http://www.ti.com/lit/an/slma002g/slma002g.pdf ) from texas (see also the attached image) it seems that in a 1 or 2 layer board I can use the top layer for heatSink problem.

    In addition it confirms what you said about using the 4 or more board layers board and buried vias.

     

    So if I decide to use the 2 layer approach I should create a copper polygon as big as possible (the red figure in the attched image)  but I cant understand where (in the package editor) or in the layout board!

    Do you have any advice on how to realize this ?image

     

    Thanks again for the support!

    Nico