Pads are different in Package Editor and in PCB Editor

Hi,

I'm creating a package for the Global Connector Technologies BC020 header (http://www.farnell.com/datasheets/682675.pdf ). The pads look different in the Package Editor than when I instantiate the device in the PCB (see attached screenshots). I'm getting a DRC error in the PCB editor because the pads are way bigger than what I want. Any ideas?

Thanks

Attachments:

PadsLayerDifferenceInPackage_PCB.pdf

0 rachaelp over 10 years ago in reply to ed@ese.wustl.edu

Hi Ed,

Yes it's Restring as you have found out! I'm glad you have got it sorted out :-)

Best Regards,

Rachael
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0 ed@ese.wustl.edu over 10 years ago in reply to ed@ese.wustl.edu

Thanks - it was the Rest Ring (Restring) settings in DRC that was overriding my pad settings in the library (EAGLE -- What are the Restring Settings in the Design Rules for? )

Ed
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0 ed@ese.wustl.edu over 10 years ago in reply to rachaelp

Hi Racheal,

Thanks for responding. Do you know which DRC settings? I have 7 mil of margin on the pad to pad clearance (last picture in the attahment).

Ed
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0 rachaelp over 10 years ago

Hi Ed,

It could be down to your DRC settings. Unlike other ECAD packages, in EAGLE the DRC settings can actually affect the board as it enforces some minimum sizes.

Best Regards,

Rachael
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