How do I control pad to polygon connection?

Question

Perhaps I'm missing something, but now (using Eagle 7.6.0) any pads matching the polygon signal are connected by hair-thin traces, not by the solid pour I would expect.

contentimage_75913.tiff

For example on R4 I would expect to see no isolation between the through-hole part (lower pin) and the Layer 16 (GND) polygon.

The designs pass ERC/DRC - is there a parameter in the autorouter setup I can adjust to cure this?

What controls this behaviour?

Thanks for any advice!

autodeskguest · Accepted Answer

Don Gibson schrieb: Perhaps I'm missing something, but now (using Eagle 7.6.0) any pads matching the polygon signal are connected by hair-thin traces, not by the solid pour I would expect. For example on R4 I would expect to see no isolation between the through-hole part (lower pin) and the Layer 16 (GND) polygon. The designs pass ERC/DRC - is there a parameter in the autorouter setup I can adjust to cure this? What controls this behaviour? I assume you included an image, but that didn't make it from the crappy E14 web-interface to the newsgroup. So I have no idea about "R4" or your particular problem. However, thermals are not related to the autorouter, but a property of the polygon. See the HELP and the manual for POLYGON, what you can do with them, and how the parameters are set. Tilmann

autodeskguest · Answer

On 29/09/16 00:46, Don Gibson wrote:

Perhaps I'm missing something, but now (using Eagle 7.6.0) any pads matching the polygon signal are connected by hair-thin traces, not by the solid pour I would expect.

I don't think this is something that has changed.

For example on R4 I would expect to see no isolation between the through-hole part (lower pin) and the Layer 16 (GND) polygon.
The designs pass ERC/DRC - is there a parameter in the autorouter setup I can adjust to cure this?

The "isolation" is for thermal reasons - it makes it easier (possible,

in some cases) to solder the pin to the pad. You can turn thermals off

for the polygon but you shouldn't. The thickness of the traces

connecting the pad across the thermal barrier is set by the "width" of

the polygon.

How do I control pad to polygon connection?

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