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Related

freeDFM & via issue

autodeskguest
autodeskguest over 17 years ago

I have a board I've submitted to freeDFM. Their error report for that board

is at:

.   https://www.freedfm.com/freedfm/0011385401921358/results/summary2.htm

The .brd file (only that file) I've made available at:

.   http://www.RGMEusa.com/Misc/USBto64RW.zip

 

I've already addressed all the issues not related to vias in another board

version, my only remaining problem is the one concerning freeDFM's complaint

about every one of the board vias.

 

If you look at the freeDFM error report it appears to my eye that all the

vias have no drill and they appear to all be filled in as if they were pads

instead of vias going through all 4 layers. I've also made available a

screen shot combination picture of the board concerning just one of the via

issues (the X=0.7641", Y=2.2966" example):

.   http://www.RGMEusa.com/Misc/SampleVia.jpg

 

It all seems ok to me so I haven't a clue as to why freeDFM is complaining.

In the combo screen shot I see it reports a drill for the example via as

0.015" and a diameter of "0.031/0.031 (auto)". I don't understand the

diameter syntax being used, meaning it looks to me like it is reporting 2

parameters separated by a "/" character. What is the definition of the 2

parameters which in the screen shot are identical to each other? If one

parameter is mathematically divided by the other the result is a zero value;

is THAT the reason freeDFM is complaining?

 

I need help understanding the nature of the problem and how to fix it. I did

generate the Execellon file while the board was displayed in the editor,

that's what was sent to freeDFM. TIA!

-Ron

 

 

 

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  • autodeskguest
    autodeskguest over 17 years ago

    Hi,

     

    When I'm testing it I have just one DRC error with design rule

    www.my4pcb.com you have select !!!

     

    Guy

     

    PS: I'm affray, you don't use any condensators on this card !!!

    I think you must minimum add decouplers condensators to be sure work ok !!!

     

     

     

    "Ron" <viaEagleForum@RGMEusa.com> a écrit dans le message de news:

    fohhbe$6br$1@cheetah.cadsoft.de...

    I have a board I've submitted to freeDFM. Their error report for that board

    is at:

    .   https://www.freedfm.com/freedfm/0011385401921358/results/summary2.htm

    The .brd file (only that file) I've made available at:

    .   http://www.RGMEusa.com/Misc/USBto64RW.zip

     

    I've already addressed all the issues not related to vias in another board

    version, my only remaining problem is the one concerning freeDFM's

    complaint

    about every one of the board vias.

     

    If you look at the freeDFM error report it appears to my eye that all the

    vias have no drill and they appear to all be filled in as if they were

    pads

    instead of vias going through all 4 layers. I've also made available a

    screen shot combination picture of the board concerning just one of the

    via

    issues (the X=0.7641", Y=2.2966" example):

    .   http://www.RGMEusa.com/Misc/SampleVia.jpg

     

    It all seems ok to me so I haven't a clue as to why freeDFM is

    complaining.

    In the combo screen shot I see it reports a drill for the example via as

    0.015" and a diameter of "0.031/0.031 (auto)". I don't understand the

    diameter syntax being used, meaning it looks to me like it is reporting 2

    parameters separated by a "/" character. What is the definition of the 2

    parameters which in the screen shot are identical to each other? If one

    parameter is mathematically divided by the other the result is a zero

    value;

    is THAT the reason freeDFM is complaining?

     

    I need help understanding the nature of the problem and how to fix it. I

    did

    generate the Execellon file while the board was displayed in the editor,

    that's what was sent to freeDFM. TIA!

    -Ron

     

     

     

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    Ron wrote:

    I have a board I've submitted to freeDFM. Their error report for that board

    is at:

    ..   https://www.freedfm.com/freedfm/0011385401921358/results/summary2.htm

    The .brd file (only that file) I've made available at:

    ..   http://www.RGMEusa.com/Misc/USBto64RW.zip

     

    I've already addressed all the issues not related to vias in another board

    version, my only remaining problem is the one concerning freeDFM's complaint

    about every one of the board vias.

     

    If you look at the freeDFM error report it appears to my eye that all the

    vias have no drill and they appear to all be filled in as if they were pads

    instead of vias going through all 4 layers. I've also made available a

    screen shot combination picture of the board concerning just one of the via

    issues (the X=0.7641", Y=2.2966" example):

    .   http://www.RGMEusa.com/Misc/SampleVia.jpg

     

    It all seems ok to me so I haven't a clue as to why freeDFM is complaining.

    In the combo screen shot I see it reports a drill for the example via as

    0.015" and a diameter of "0.031/0.031 (auto)". I don't understand the

    diameter syntax being used, meaning it looks to me like it is reporting 2

    parameters separated by a "/" character. What is the definition of the 2

    parameters which in the screen shot are identical to each other? If one

    parameter is mathematically divided by the other the result is a zero value;

    is THAT the reason freeDFM is complaining?

     

    I need help understanding the nature of the problem and how to fix it. I did

    generate the Execellon file while the board was displayed in the editor,

    that's what was sent to freeDFM. TIA!

    -Ron

     

     

    I don't see any problem there. Lets see the Drill tab on your CAM

    project. I bet something is not selected in the CAM properly.

     

    --

    Travis Grenell

    The CarPC Store

    404-403-0556

    http://www.TheCarPCStore.com

     

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  • autodeskguest
    autodeskguest over 17 years ago

    Ron wrote:

     

    I have a board I've submitted to freeDFM. Their error report for that board

    is at:

    .   https://www.freedfm.com/freedfm/0011385401921358/results/summary2.htm

    The .brd file (only that file) I've made available at:

    .   http://www.RGMEusa.com/Misc/USBto64RW.zip

     

    I've already addressed all the issues not related to vias in another board

    version, my only remaining problem is the one concerning freeDFM's complaint

    about every one of the board vias.

     

    If you look at the freeDFM error report it appears to my eye that all the

    vias have no drill and they appear to all be filled in as if they were pads

    instead of vias going through all 4 layers. I've also made available a

    screen shot combination picture of the board concerning just one of the via

    issues (the X=0.7641", Y=2.2966" example):

    .   http://www.RGMEusa.com/Misc/SampleVia.jpg

     

    It all seems ok to me so I haven't a clue as to why freeDFM is complaining.

    In the combo screen shot I see it reports a drill for the example via as

    0.015" and a diameter of "0.031/0.031 (auto)". I don't understand the

    diameter syntax being used, meaning it looks to me like it is reporting 2

    parameters separated by a "/" character. What is the definition of the 2

    parameters which in the screen shot are identical to each other? If one

    parameter is mathematically divided by the other the result is a zero value;

    is THAT the reason freeDFM is complaining?

     

    I need help understanding the nature of the problem and how to fix it. I did

    generate the Execellon file while the board was displayed in the editor,

    that's what was sent to freeDFM. TIA!

    -Ron

     

     

     

    Ron

     

    Referring to "http://www.RGMEusa.com/Misc/USBto64RW.zip", I see problems

    that will cause your board to fail to work correctly:

    1) There are NO power and ground planes.  With a 4 layer board, usually

    the 2 inner layers are used for power and ground.  In  your case, this

    is VCC and VSS.  At the minimum, use a gridded power scheme.  Using

    copper flooding for GND (VSS) is also a good idea.

    2) I don't see any bypass/de-coupling and bulk capacitors.  There should

    be a 0.1uF ceramic bypass cap near each TTL and CMOS chip.

     

    Texas Instruments' publication # SZZA009 shows how to create a gridded

    power and ground system.  This doc also has other good ideas.

     

    HTH

    -Dave Pollum

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    "Travis G" <fightspammers@gmail.com> wrote in message

    news:fohqsm$tdq$1@cheetah.cadsoft.de...

    Ron wrote:

    I have a board I've submitted to freeDFM. Their error report for that

    board is at:

    ..

    https://www.freedfm.com/freedfm/0011385401921358/results/summary2.htm

    The .brd file (only that file) I've made available at:

    ..   http://www.RGMEusa.com/Misc/USBto64RW.zip

     

    I've already addressed all the issues not related to vias in another

    board version, my only remaining problem is the one concerning freeDFM's

    complaint about every one of the board vias.

     

    If you look at the freeDFM error report it appears to my eye that all the

    vias have no drill and they appear to all be filled in as if they were

    pads instead of vias going through all 4 layers. I've also made available

    a screen shot combination picture of the board concerning just one of the

    via issues (the X=0.7641", Y=2.2966" example):

    .   http://www.RGMEusa.com/Misc/SampleVia.jpg

     

    It all seems ok to me so I haven't a clue as to why freeDFM is

    complaining. In the combo screen shot I see it reports a drill for the

    example via as 0.015" and a diameter of "0.031/0.031 (auto)". I don't

    understand the diameter syntax being used, meaning it looks to me like it

    is reporting 2 parameters separated by a "/" character. What is the

    definition of the 2 parameters which in the screen shot are identical to

    each other? If one parameter is mathematically divided by the other the

    result is a zero value; is THAT the reason freeDFM is complaining?

     

    I need help understanding the nature of the problem and how to fix it. I

    did generate the Execellon file while the board was displayed in the

    editor, that's what was sent to freeDFM. TIA!

    -Ron

    I don't see any problem there. Lets see the Drill tab on your CAM project.

    I bet something is not selected in the CAM properly.

     

    --

    Travis Grenell

    The CarPC Store

    404-403-0556

    http://www.TheCarPCStore.com

     

    Hmmm. I don't think I have such an animal, Travis. I used the Excellon job

    while the project was loaded, per the manual. It just spat out the 2 drill

    files for gerber inclusion. I noticed theat one of the 2 files has a

    different filename suffix than what the manual specifies it should be, but

    freeDFM didn't complain about that (I don't think) so the format must have

    been ok? They looked ok to me (which means little). Is that what you want to

    see? If so, I'll have to put the Excellon file onto the server tonight after

    work. When I look only at layer 44, Drills, I see what appears to be overlap

    of drills but all vias are supposed to go through all layers and not some of

    them through just some layers, so that's giving me some confusion. Or do you

    mean you want to see the actual cam job, a modified GERBER_RS274X job? Gotta

    hold my hand a bit here, I'm not experienced enough yet to understand some

    things that in time will become crystal clear to me!

    -Ron

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    Ron wrote:

      > Hmmm. I don't think I have such an animal, Travis. I used the

    Excellon job

    while the project was loaded, per the manual. It just spat out the 2 drill

    files for gerber inclusion. I noticed theat one of the 2 files has a

    different filename suffix than what the manual specifies it should be, but

    freeDFM didn't complain about that (I don't think) so the format must have

    been ok? They looked ok to me (which means little). Is that what you want to

    see? If so, I'll have to put the Excellon file onto the server tonight after

    work. When I look only at layer 44, Drills, I see what appears to be overlap

    of drills but all vias are supposed to go through all layers and not some of

    them through just some layers, so that's giving me some confusion. Or do you

    mean you want to see the actual cam job, a modified GERBER_RS274X job? Gotta

    hold my hand a bit here, I'm not experienced enough yet to understand some

    things that in time will become crystal clear to me!

    -Ron

     

    I'd like to see the actual job (ends in .cam) plus your generated drill

    files (usually .drd and also the .dri file) to compare everything, step

    by step.

     

    --

    Travis Grenell

    The CarPC Store

    404-403-0556

    http://www.TheCarPCStore.com

     

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  • autodeskguest
    autodeskguest over 17 years ago

    2) I don't see any bypass/de-coupling and bulk capacitors.  There should

    be a 0.1uF ceramic bypass cap near each TTL and CMOS chip.

     

    Agree with you

     

    Guy

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    "Guy" <guy.dau_no_spam@free.fr> wrote in message

    news:fohqh1$sgn$1@cheetah.cadsoft.de...

    Hi,

     

    When I'm testing it I have just one DRC error with design rule

    www.my4pcb.com you have select !!!

     

    Guy

     

    PS: I'm affray, you don't use any condensators on this card !!!

    I think you must minimum add decouplers condensators to be sure work ok

    !!!

     

    Yes, that version had too tight of clearance for those 2 pins - I corrected

    that already. Annoyed me, as when I auto routed that one trace the DRC rules

    were not followed and I had to move the trace manually one grid away from

    IC1. Luckily, there is a DRC check button!

     

    Guy, this design (and the hand wired proto) definitely does not need VCC

    bypass capacitors. It's a state machine, no clocking, and the USB module

    (it's not a chip) includes its own decoupling to the USB buss; what that

    module connects to is not powered by the USB buss and it is rather slow and

    usually just sitting in one state. I do, however, need to (or should)

    increase distance between the Power class traces. I gotta rip again anyhow

    when I find out why freeDRM doesn't like the vias, I'll change the class

    then.

    -Ron

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

     

    "Ron" <Use@Forum.pls> a écrit dans le message de news:

    foicn5$rug$1@cheetah.cadsoft.de...

    "Guy" <guy.dau_no_spam@free.fr> wrote in message

    news:fohqh1$sgn$1@cheetah.cadsoft.de...

    Hi,

     

    When I'm testing it I have just one DRC error with design rule

    www.my4pcb.com you have select !!!

     

    Guy

     

    PS: I'm affray, you don't use any condensators on this card !!!

    I think you must minimum add decouplers condensators to be sure work ok

    !!!

     

    Yes, that version had too tight of clearance for those 2 pins - I

    corrected that already. Annoyed me, as when I auto routed that one trace

    the DRC rules were not followed and I had to move the trace manually one

    grid away from IC1. Luckily, there is a DRC check button!<smile>

     

    Guy, this design (and the hand wired proto) definitely does not need VCC

    bypass capacitors. It's a state machine, no clocking, and the USB module

    (it's not a chip) includes its own decoupling to the USB buss; what that

    module connects to is not powered by the USB buss and it is rather slow

    and usually just sitting in one state. I do, however, need to (or should)

    increase distance between the Power class traces. I gotta rip again anyhow

    when I find out why freeDRM doesn't like the vias, I'll change the class

    then.

    -Ron

    No !!

     

    It's not because it's a state machine and no clocking then decoupling is not

    necessary !!!

     

    With all these circuits and not decoupling, alimentation can start in

    resonance !!!

     

    With many TTL and CMOS you don't know alimentation reaction !!

     

    I think you must define any bypass/de-coupling and after perhaps not

    necessary to put all but you don't know !!!!!

     

    After many years of electronic developpement.......

     

    Sorry for my english,

     

    Guy

     

     

     

     

     

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    "Guy" <guy.dau_no_spam@free.fr> wrote in message

    news:foiedu$vrq$1@cheetah.cadsoft.de...

     

    "Ron" <Use@Forum.pls> a écrit dans le message de news:

    foicn5$rug$1@cheetah.cadsoft.de...

    "Guy" <guy.dau_no_spam@free.fr> wrote in message

    news:fohqh1$sgn$1@cheetah.cadsoft.de...

    Hi,

     

    When I'm testing it I have just one DRC error with design rule

    www.my4pcb.com you have select !!!

     

    Guy

     

    PS: I'm affray, you don't use any condensators on this card !!!

    I think you must minimum add decouplers condensators to be sure work ok

    !!!

     

    Yes, that version had too tight of clearance for those 2 pins - I

    corrected that already. Annoyed me, as when I auto routed that one trace

    the DRC rules were not followed and I had to move the trace manually one

    grid away from IC1. Luckily, there is a DRC check button!<smile>

     

    Guy, this design (and the hand wired proto) definitely does not need VCC

    bypass capacitors. It's a state machine, no clocking, and the USB module

    (it's not a chip) includes its own decoupling to the USB buss; what that

    module connects to is not powered by the USB buss and it is rather slow

    and usually just sitting in one state. I do, however, need to (or should)

    increase distance between the Power class traces. I gotta rip again

    anyhow when I find out why freeDRM doesn't like the vias, I'll change the

    class then.

    -Ron

    No !!

     

    It's not because it's a state machine and no clocking then decoupling is

    not necessary !!!

     

    With all these circuits and not decoupling, alimentation can start in

    resonance !!!

     

    With many TTL and CMOS you don't know alimentation reaction !!

     

    I think you must define any bypass/de-coupling and after perhaps not

    necessary to put all but you don't know !!!!!

     

    After many years of electronic developpement.......

     

    Sorry for my english,

     

    Guy

     

    This is getting way off topic but I do respect and appreciate your usage of

    English, please do not apologize. Although you could use a few less "!!!!!"

    characters!!!!!  You are understandable and if the situation were

    reversed I'd be, knowing only English, unable to return the courtesy.  But

    most of all I respect your knowledge.

     

    I would again try to qualify my agreement with what you say, which I believe

    to be a reference to a phenomenon known as parasitic resonance and which is

    a common annoyance in RF circuits. RF infers oscillation, and oscillating

    circuits have maximum power response at a resonant frequency.  My point is

    that there must be oscillation before there can be resonance, parasitic or

    not. This occurs in digital circuits primarily because of repeating patterns

    of current flow at high bit level changing rates (what I mean by "clocked",

    be it data pattern repetition or any other time base). The capacitive

    "decoupling" or "bypassing" is actually the detuning of the resonant

    circuit, dampening the amplitude of unintended oscillations to negligible

    level.  This is usually a very important consideration.

     

    But, if my design works (and the prototype does) and it experiences

    oscillations then it is malfunctioning because the amplitude of the

    oscillation would have to be of sufficient energy as to overpower the power

    supply as relates to the guaranteed high or low level specified for a gate

    input. If the power supply is working and distributed properly then that

    would have to be a rather huge amount of energy.  Without oscillation there

    can be no resonance.  If there can be no resonance then decoupling is not

    required.

     

    In this board all I/O is inherently latched. Even when changing at USB 2.0

    speed, the amount of time between cycles of a particular bit pattern that

    just happens to be resonant is what keeps enough energy from entering the

    tank to build sufficiently to overcome the power supply to a level where a

    gate would see a logic change. There simply aren't enough such cycles within

    a sufficiently small enough time period to build enough energy in a tank to

    sustain oscillation. If Murphy gets into the act regardless, then the

    mentioned time period can be lengthened by slowing down USB usage - thus

    detuning the tank.

     

    This board is an exception to the general rule that decoupling should be

    used. Primarily because it is latched and not clocked by some means.

    Repetitive tank pumping is not likely because repetitiveness does not exist

    in a latched circuit like it does in a clocked circuit. It would not hurt to

    use decoupling, except for production cost. My only worry with the entire

    design is that I might be exceeding the fan out rating of the USB module. If

    so, the resultant instability is not due to resonance or oscillation. On

    this board decoupling would be of little use, malfunction must begin before

    resonant oscillation can occur.

    -Ron

     

     

     

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  • autodeskguest
    autodeskguest over 17 years ago

    "Guy" <guy.dau_no_spam@free.fr> wrote in message

    news:foicb4$qva$1@cheetah.cadsoft.de...

    2) I don't see any bypass/de-coupling and bulk capacitors.  There should

    be a 0.1uF ceramic bypass cap near each TTL and CMOS chip.

     

    Agree with you

     

    Guy

     

    Ok Guy(s)! Have mercy. I don't deny it's good design practice but I'm not

    using the advice with this particular design. Please, I need to keep the

    topic focus to the subject line of this thread.

    -Ron

     

     

     

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Premier Farnell Ltd, registered in England and Wales (no 00876412), registered office: Farnell House, Forge Lane, Leeds LS12 2NE.

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