Hi, I need to adjust the solder paste apertures under certain parts that
have large "belly pads" without necessarily adjusting the smaller pads. I
know a size reduction of paste vs. pad can be done in the DRC->masks->cream
for the entire surface, but I want to know how to modify the paste apertures
on a part-by-part basis. I am getting reflow errors due to "too much paste"
on some pads. The datasheets for some of these parts recommend changes to
the paste apertures to improve reflow, so, how do I achieve this? Thanks.