Package vias change sizes when in board layout

I have a connector requiring through holes that are 0.059" (1.5mm) apart from each other, center to center. The via flange width (outer restring) needs to be 0.0019685" (0.15mm). I drew this up in created my custom package and device but when I look at it in the board editor all of the vias are touching each other. I looked in the design rules and could not see how to get this to work. Is this just too small and not possible?

0 Former Member over 13 years ago

jmoulton wrote:
I have a connector requiring through holes that are 0.059" (1.5mm)
apart from each other, center to center. The via flange width (outer
restring) needs to be 0.0019685" (0.15mm). I drew this up in created
my custom package and device but when I look at it in the board
editor all of the vias are touching each other. I looked in the
design rules and could not see how to get this to work. Is this just
too small and not possible?

It's possible

When changing the design rules for the restring care must be taken to change
all three (top,inner,bottom) settings otherwise you will not see the size
reduction as the largest pad will hide the smaller pads
(This assumes you have pads set to Green and not the editor background
colour.)

So assuming, for your connector, the drill diameter to restring width ratio
is not abnormal. Change the 'Min' setting to 0.15mm for the pads on all
layres. If the 0.15mm is greater than 25% (default) of the drill diameter
the resting will be increased to the minimum (desired) 0.15mm. If it
calculates to be greater than 0.15mm you would have to reduce the percentage
figure.

As the DRC settings are global, you should check that this has not impacted
the other packages in the board editor and resulted in an unresonabley small
restring

HTH
Warren
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