I'm designing a 2 layer RF board and I'd like to stitch the two ground planes together with many vias. Any thoughts on how to do this?
Do I have to do this completely by hand?
I'm designing a 2 layer RF board and I'd like to stitch the two ground planes together with many vias. Any thoughts on how to do this?
Do I have to do this completely by hand?
Mark Kahrs wrote:
I'm designing a 2 layer RF board and I'd like to stitch the two
ground planes together with many vias. Any thoughts on how to do
this?
Do I have to do this completely by hand?
Hi Mark
There is a ULP you can download named "via-fill.ulp"
ftp://ftp.cadsoft.de/eagle/userfiles/ulp/via-fill.ulp
You may need to place vias manually. If so set yourself up so that the via
parameters are set up and the via signal name is pre-named, then you only
need click the placement points.
HTH
Warren
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I tried the above .ulp and well, it didn't work for me. I ended up doing it by hand. It's an interesting problem in applied computational geometry and I invite others to take up the task.