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How to create a PowerPad package with the holes includes

Former Member

image

 

This is a picture I like, with the 8 pin regulator REG+ package with the holes for thermal dissipation. The other side is a ground plane.

There is no space without copper around the holes, so the dissipation is good.

 

I can not do this and I tried a lot. Can you help me?

 

Thank you

Fernando

  • 0

    Fernando Silva wrote:

    >This is a picture I like, with the 8 pin regulator REG+ package with the holes

    >for thermal dissipation. The other side is a ground plane.

    >There is no space without copper around the holes, so the dissipation is good.

    >I can not do this and I tried a lot. Can you help me?

     

    assuming you are still on <= 5.x? In that case it's not possible to do

    that in the library.

    --

     

    Lorenz

     

  • 0 in reply to Former Member

    Lorenz wrote:

    Fernando Silva wrote:

    >> This is a picture I like, with the 8 pin regulator REG+ package with

    >> the holes for thermal dissipation. The other side is a ground plane.

    >> There is no space without copper around the holes, so the

    >> dissipation is good.

    >>

    >> I can not do this and I tried a lot. Can you help me?

     

    assuming you are still on <= 5.x? In that case it's not possible to do

    that in the library.

    --

     

    Lorenz

     

     

    Fair comment for v5  You cannot achieve that  final look by just creating

    the package in the library.

    The 5 air holes could be created in the board  editor using vias (named GND

    or whatever the ground on the other side of your board is named.)

     

    In the library, in a user defined layer, place some markers to act as guides

    for placing  the vias once your package is positioned on the board. Note the

    holes/vias  will not move with the package, which is a shortcoming of the

    technique but easy enough to manage.

     

     

    HTH

    Warren

     

    --

    Viewed / responded via the newsgroup at

    news.cadsoft.de

     

     

     

  • 0 in reply to Former Member

    Thank you for the answers.

    I am using Eagle 6.1.

     

    I used vias but I would like to have a package...

     

    One test I did was quite good but I got a DRC message like "Layer abuse". I don't remember what I was doing.

     

    I just tried to understand how Eagle works with a little test:

    In the package I created a circle in layer 44 Drills. I can see it on the board editor. I confirmed the CAM use layers 44 and 45 for generating the .TXT file (device EXCELLON). But the resulting TXT file has no hole (acording GERBV). I need an hole with metalic walls (like vias and pads).

    Can someone explain me how the layers work inside the package and how can I simulate holes, vias an pads drawing figures and choosing layers?

     

    Thank you