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tCream layer generation for Through Hole reflow soldering

gussabina

Hi:

 

I will use a stencil to apply solder paste to the pcb in order to assembly the board using a reflow oven. For SMD components, the tCream and bCream are generated, so these files can be used to generate the stencil.

 

Now, since I have few Through Hole parts, I would like to solder them also using the reflow oven (process also known as Pin In Paste) to avoid soldering by hand. My question is how can I add the through hole components to the tCream layer? (by default, tCream is only generated for SMD pads, no TH)

 

Thanks in advance.

Gus

  • 0

    Gus Sabina wrote:

    >I will use a stencil to apply solder paste to the pcb in order to assembly the board using a

    >reflow oven. For SMD components, the tCream and bCream are generated, so these files

    >can be used to generate the stencil.

    >Now, since I have few Through Hole parts, I would like to solder them also using the reflow

    >oven (process also known as Pin In Paste) to avoid soldering by hand. My question is how

    >can I add the through hole components to the tCream layer? (by default, tCream is only

    >generated for SMD pads, no TH)

     

    just draw the required shapes in the tCream layer or add them to the

    library parts as new packages

    --

     

    Lorenz

     

  • 0 in reply to Former Member

    On 07/31/2012 01:19 AM, Lorenz wrote:

    Gus Sabina wrote:

    >> I will use a stencil to apply solder paste to the pcb in order to assembly the board using a

    >> reflow oven. For SMD components, the tCream and bCream are generated, so these files

    >> can be used to generate the stencil.

    >>

    >> Now, since I have few Through Hole parts, I would like to solder them also using the reflow

    >> oven (process also known as Pin In Paste) to avoid soldering by hand. My question is how

    >> can I add the through hole components to the tCream layer? (by default, tCream is only

    >> generated for SMD pads, no TH)

     

    just draw the required shapes in the tCream layer or add them to the

    library parts as new packages

     

     

    It's even easier than that.  Just include the PADS layer (layer 17) in

    the sections of your CAM job that generates the stencil.

     

    I'd be interested in hearing how well this works.  I suspect that you

    will push most of the paste out of the through-hole when you insert the

    part lead.

     

    Hope this helps,

        - Chuck

     

  • 0 in reply to dukepro

    Hi:

     

    I already tried including the PADs layer and it looks fine except for the holes of the pads ( through hole), which I'm not sure if it will be a problem for the stencil... Anyway, I will contact the stencil company to ask if it's OK.

     

    Regarding this methodology, there is a lot of information out there and it seems it works... That's why I want to test it out. Check this link out;

     

    http://www.eurocircuits.com/index.php/eurocircuits-printed-circuits-blog/through-hole-component-soldering-with-the-ec-reflow-mate

     

    Regards;

    Gus