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What to use to solder wire connections for input power?

Former Member

I'm currently using SMD pads on the bottom layer of the board as my input solder points for my +12V wire and my GND wire. Is this the best thing to use, since I can use a ground plain and it will automatically connect the ground pad to the ground plain, or should I use something different, and if so what should I use?

  • 0

    Sometimes, when making a place to solder a wire onto a copper plane, little circular voids in the Cu plane are placed 'round the hole, so that heat can localize around the hole making soldering easier and avoiding overheating the glue that attaches the copper to the board.

  • 0 in reply to D_Hersey

    what "component" would that be in eagle, when making my schematic/board. Also, is it something I could assign to the bottom of the board?

  • 0 in reply to Former Member

    Here is some info copied from another discussion:

    The pad objects you refer to are called 'thermals'.

     

    There is a 'Thermal' setting for Polygons and Pads/SMDs.

    The thermal setting for 'Pads/SMDs' needs to be set in the library Package Editor.

    The thermal settting for signal polygons ( a polygon on a copper layer)is done in the package board editor or board editor.

     

    The Pad/SMD setting has precedence.

    When the Pad/SMD thermal setting is set on. The presence of a thermal follows the setting of the polygon.

     

    When the Pad/SMD thermal setting is set off. There is never a thermal created, no matter what the setting of the thermal property of the polygon.

     

    Vias can have thermals. There is a setting in the DRC on the 'Supply' tab that controls them. "Generate Thermals for Vias"


    SMT pads may be assigned to the bottom layer using the Mirror tool.