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Questions regarding 2+ layer PCB design

Former Member

Hello, I've done 4 layer projects successfully using EPCB and their software.

 

Now I'm converting the project to 6 layers, with added capabilities, and have chosen Eagle since the board manufacturer I've had to switch to favors this program. I've downloaded the manufacturer's .dru file for a  6 layer board. Now I'm trying to figure out how to assign which layer a via connects to. Presently, the .dru file is only letting me connect from the top to the bottom layers.

 

Also, since this project uses 256-pin BGA's I don't use schematics. I would like to do this starting from scratch in PCB design.

 

So how do I go about assign a layer to a via? Thanks

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  • 0

    Hi,

    You have to edit the DRU file (DRC, 'layers' tab). You have to configure the stacking, in away that you could have buried and/or blind via. But check with your manufacturer, that he will be able to build your PCB (unless you really like bad surprises !)

    Guillaume.

  • 0 in reply to kikoun

    Hi Guillaume,

         Thanks for your response. I will contact them soon as a prospective board manufacturer, but since I'm a hobbyist I don't want to look "ignorant", so I try to gather more information in this new endeavor. This is the result of loading their .dru file:

     

    image

    Should it look more like this? There are no buried vias in this design, just straight drilling through all layers for all vias, just that the vias may connect to one or more layers from the top to any layer below....

    image

  • 0 in reply to Former Member

    HI,

    In your second design you don't have buried via, just normal via and blind via.

    The normal via is standard and really common. But blind via is less common, and you have to be sure that your manufacturer can do it, and if you don't have additional charges for blind via.

    Usually the stacking is symmetrical, if it's possible, through holes are plated after pressing all layer, except for buried via (need a to be plated before pressing external layer -> extra cost).

    But for blind via I don't know if there is extra cost. Let me know !

    Guillaume.

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  • 0 in reply to Former Member

    HI,

    In your second design you don't have buried via, just normal via and blind via.

    The normal via is standard and really common. But blind via is less common, and you have to be sure that your manufacturer can do it, and if you don't have additional charges for blind via.

    Usually the stacking is symmetrical, if it's possible, through holes are plated after pressing all layer, except for buried via (need a to be plated before pressing external layer -> extra cost).

    But for blind via I don't know if there is extra cost. Let me know !

    Guillaume.

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