I am concerned that the traces that are automatically generated between plated through holes and a ground pour are too thin. Say I have two plated through holes to connect to the positive and negative supply from a battery. I can choose a 50mil trace from the positive, but I have no control over the size of those tiny little traces generated with the ground pour. If the pour surrounds the PTH it is connected by four little traces, but if the pour only borders one side of the PTH you only get one tiny little trace. Can you use the wire tool to draw a 50mil trace from a PTH into the pour or will the software freak out when the gerbers are generated?
What size are those little traces anyway, and how many amps can they carry? Where can I adjust their size?
Cheers all. Matt.