I have a problem I can't seem to solve.
I am making a board using Lumileds Rebel. There are two options for
thermals, one is a bunch of vias around the device, the other uses filled
and capped vias. The one in the Lumileds library uses the regular vias
around the LED, I want to define my own using the filled capped vias. So
I want a matrix of 0.5mm vias that overlaps the thermal pad.
Here are the problems I am having
1) When I define the vias in the package with a very small annular ring,
then when I bring that package into the device, it changes the ring and
the vias all overlap (not such a problem since they are all tied to a
copper pour on the front and back of the board, so it's all one big copper
pad anyway, but it causes a lot of DRC errors since they are "too close")
2) When I place the device on my board, it automatically adds the solder
stop mask to the vias, which I don't want. I only want the stop mask over
the thermal pad. Some of the vias are in the pad, some are partially in
the pad. But I want to sort of override the stop mask on the vias, but I
can't seem to do this
3) Once I place my devices, I want to add additional vias (that the board
house will do as filled/capped) between the components. But again, Eagle
adds the solder stop mask to these vias.
How can I turn off solder stop mask on the vias I add to my board, as well
as to vias that are in the package definition? Any ideas?
Thanks
Mick
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