Let's say you have a sot223 with 4 pads and you want to add some more copper to pad 4 to allow it to cool better. How can this be done on the package? It does not like it when I add a wide trace to it on the top copper layer (drc errors).
Let's say you have a sot223 with 4 pads and you want to add some more copper to pad 4 to allow it to cool better. How can this be done on the package? It does not like it when I add a wide trace to it on the top copper layer (drc errors).
You can add copper to the top layer at your pad, just make sure to name the
copper using the same net the particular pad uses. This is referring to
the actual board layout, not your library (there may be a way to do that as
well).
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I was hoping for a way to make the changes in the library, but I don't see a way to name traces the same as the pin in the device editor... Any other thoughts on how to do this?
See the manual
8.14 Arbitrary Pad Shapes
HTH
Warren
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Thanks Warren, I did try this and it worked. Does it only work with polygon's? I don't think it worked with a trace when I tried that.
On 7/07/2015 2:14 a.m., alank2 wrote:
Thanks Warren, I did try this and it worked. Does it only work with
polygon's? I don't think it worked with a trace when I tried that.
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It works with WIRE in a package
See HELP>Editor Commands>PAD> Arbitrary Pads Shapes
HTH
Warren