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Problem connecting Power Pads to GND polygon

autodeskguest

I am designing a board that includes several kinds of ICs

with "Power Pads" under the IC package that need

to be grounded.  For some of the ICs, the GND polygon

connects to the Power Pad as it should.  For other

ICs, the GND polygon is not connecting to the Power Pad.

Examining the devices in the library, they appear to be

constructed and labeled the same way.  I can't see

a difference in labeling, pin declaration, or grounding

between the ones that connect to ground and the ones

that don't.

 

Can you suggest what might be different between the

ICs or the libraries to cause this?

 

Thank you,

--- Graham

 

==

 

Parents

  • now i understand your problem. my stupidity, you clearly wrote your

    title to be "connecting". now it all makes sense.

     

    so your pad is so big that you can't form a proper thermal for the SMD,

    hence EAGLE substitutes no connection! the only things i can think of,

    you've already done, turn off thermals or add connections by hand. i'd

    turn off the thermals or maybe you could adjust their size? i'd just

    turn them off as you've done.

     

Reply

  • now i understand your problem. my stupidity, you clearly wrote your

    title to be "connecting". now it all makes sense.

     

    so your pad is so big that you can't form a proper thermal for the SMD,

    hence EAGLE substitutes no connection! the only things i can think of,

    you've already done, turn off thermals or add connections by hand. i'd

    turn off the thermals or maybe you could adjust their size? i'd just

    turn them off as you've done.

     

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