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EAGLE User Support (English) Best way to reverse a LM317 or TIP42C NPN Transistor
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Related

Best way to reverse a LM317 or TIP42C NPN Transistor

autodeskguest
autodeskguest over 16 years ago

I would like to reverse a LM317 or TIO42C.  I would like to add a

polygon and mount the LM317 on the bottom and use the polygon as a built

on heat sink.  I could save money on adding a heatsink and also make the

board thinner by not having to have the component stand up.  Is this

do-able?  Thanks

Carroll

 

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  • autodeskguest
    autodeskguest over 16 years ago

    cjolly schrieb:

    I would like to reverse a LM317 or TIO42C.  I would like to add a

    polygon and mount the LM317 on the bottom and use the polygon as a built

    on heat sink.  I could save money on adding a heatsink and also make the

    board thinner by not having to have the component stand up.  Is this

    do-able?  Thanks

    Carroll

    Reverse it where? in the .sch or .brd?

    In schematic use MIRROR, ROTATE or just MOVE and right mouseklick.

    Nearly same goes for board except that MIRROR moves the component to the

    bottom side of the pcb.

    Polygon is no problem as a heatsink. Just draw the form. If you want the

    polygon be connected with other signals, gnd i.e., you must give the

    polygon the same name. To calculate the polygon area, you use RATSNEST,

    but this has to be activated in the options of eagle.

     

    --

    Gruß / regards

     

    Joern

     

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  • autodeskguest
    autodeskguest over 16 years ago

    Joern Paschedag wrote:

    cjolly schrieb:

    I would like to reverse a LM317 or TIO42C.  I would like to add a

    polygon and mount the LM317 on the bottom and use the polygon as a

    built on heat sink.  I could save money on adding a heatsink and also

    make the board thinner by not having to have the component stand up. 

    Is this do-able?  Thanks

    Carroll

    Reverse it where? in the .sch or .brd?

    In schematic use MIRROR, ROTATE or just MOVE and right mouseklick.

    Nearly same goes for board except that MIRROR moves the component to the

    bottom side of the pcb.

    Polygon is no problem as a heatsink. Just draw the form. If you want the

    polygon be connected with other signals, gnd i.e., you must give the

    polygon the same name. To calculate the polygon area, you use RATSNEST,

    but this has to be activated in the options of eagle.

     

     

    Right now I cant answer for sure since My Eagle is not up and running

    thus I can not check my 2 cent but as I understand it you only find the

    vertical version and not the horisontal version of the package.

     

    As far as I know there should be an horisontaly version in the library

    or atleast an part which is similar in function and uses the same

    package but which package is horisontaly.

     

    Use Technology option to change package.

     

    Offcourse there is also always an option to enhance the library.

     

    Breg

    Vidar(Z)

     

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  • autodeskguest
    autodeskguest over 16 years ago

         Thank you for your response. Believe it or not, I woke up with the answer.

         Looking at the top of the board, I have the component with the pins on

    the left side and the body on the right.  If I flip the component over

    vertically as I first thought, it will be on the solder side of the

    board, but pins 1 and 3 will be incorrect.  However, if I shift the

    traces to the right side and flip the component horizontally

    and solder the pins on the trace side, it lines up the way I want it.  I

         know there are a lot of factors invoived, but do you think 1.5

    square, 1 ounce copper will be enough of a heat sink for 13.5 volts, .5

    amps?

     

    Thanks again.

     

    Carroll

    Vidar(Z) wrote:

    Joern Paschedag wrote:

    cjolly schrieb:

    I would like to reverse a LM317 or TIO42C.  I would like to add a

    polygon and mount the LM317 on the bottom and use the polygon as a

    built on heat sink.  I could save money on adding a heatsink and also

    make the board thinner by not having to have the component stand up. 

    Is this do-able?  Thanks

    Carroll

    Reverse it where? in the .sch or .brd?

    In schematic use MIRROR, ROTATE or just MOVE and right mouseklick.

    Nearly same goes for board except that MIRROR moves the component to

    the bottom side of the pcb.

    Polygon is no problem as a heatsink. Just draw the form. If you want

    the polygon be connected with other signals, gnd i.e., you must give

    the polygon the same name. To calculate the polygon area, you use

    RATSNEST, but this has to be activated in the options of eagle.

     

     

    Right now I cant answer for sure since My Eagle is not up and running

    thus I can not check my 2 cent but as I understand it you only find the

    vertical version and not the horisontal version of the package.

     

    As far as I know there should be an horisontaly version in the library

    or atleast an part which is similar in function and uses the same

    package but which package is horisontaly.

     

    Use Technology option to change package.

     

    Offcourse there is also always an option to enhance the library.

     

    Breg

    Vidar(Z)

     

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  • autodeskguest
    autodeskguest over 16 years ago

    On 11/14/2009 10:57 PM, cjolly wrote:

    Thank you for your response. Believe it or not, I woke up with the answer.

    Looking at the top of the board, I have the component with the pins on

    the left side and the body on the right. If I flip the component over

    vertically as I first thought, it will be on the solder side of the

    board, but pins 1 and 3 will be incorrect. However, if I shift the

    traces to the right side and flip the component horizontally

    and solder the pins on the trace side, it lines up the way I want it. I

    know there are a lot of factors invoived, but do you think 1.5 square, 1

    ounce copper will be enough of a heat sink for 13.5 volts, .5 amps?

     

    Thanks again.

     

    Carroll

    Vidar(Z) wrote:

     

    If this is a LM317: is 13.5V the input or output voltage? And if it's

    output, what is the input voltage?

     

    Travis

     

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  • autodeskguest
    autodeskguest over 16 years ago

    Travis G wrote:

    On 11/14/2009 10:57 PM, cjolly wrote:

    Thank you for your response. Believe it or not, I woke up with the

    answer.

    Looking at the top of the board, I have the component with the pins on

    the left side and the body on the right. If I flip the component over

    vertically as I first thought, it will be on the solder side of the

    board, but pins 1 and 3 will be incorrect. However, if I shift the

    traces to the right side and flip the component horizontally

    and solder the pins on the trace side, it lines up the way I want it. I

    know there are a lot of factors invoived, but do you think 1.5 square, 1

    ounce copper will be enough of a heat sink for 13.5 volts, .5 amps?

     

    Thanks again.

     

    Carroll

    Vidar(Z) wrote:

     

    If this is a LM317: is 13.5V the input or output voltage? And if it's

    output, what is the input voltage?

     

    Travis

    Output, input of 17V

     

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  • autodeskguest
    autodeskguest over 16 years ago

    If this is a LM317: is 13.5V the input or output voltage? And if it's

    output, what is the input voltage?

     

    Travis

    Output, input of 17V

     

     

    PCB copper area needed to keep the part at or below 100degC under

    natural convection is about 26cm^2.

     

    Travis

     

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  • autodeskguest
    autodeskguest over 16 years ago

    Travis G wrote:

    If this is a LM317: is 13.5V the input or output voltage? And if it's

    output, what is the input voltage?

     

    Travis

    Output, input of 17V

     

    PCB copper area needed to keep the part at or below 100degC under

    natural convection is about 26cm^2.

     

    Travis

    Thank you.  I'll give it a shot.

     

     

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