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Autodesk EAGLE
EAGLE User Support (English) Creating a library with the help of SMD,   PAD, and another commands
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Related

Creating a library with the help of SMD,   PAD, and another commands

autodeskguest
autodeskguest over 15 years ago

Hi people, i am new here.

 

I want to create a library for the TI tlc5927. It has a lot of connections,

so I decided to learn to use the command line: SMD, PAD, etc.

 

I explain step by step what I've done.

 

Component's datasheet:

http://focus.ti.com/docs/prod/folders/print/tlc5927.html

 

STEP 1: Read the datasheet and look for the information about the pins,

measures, recommended footprint, etc. I have marked in red the information

that I use.

 

 

What I need are the dimmensions of the pads and the big thermal pad (in

red).

 

STEP 2: Calculate the relative positions of every pad referring to the

origin (blue cross in the picture). I use a excel sheet to calculate easily

the position of every pad, like:

 

 

STEP 3: With this Information I prepare a file .scr that will create the

footprint automatically.

 

Quote:

  1. Thermal pad

SMD 7.8 3.4 (3.9 0);

 

  1. Upper row

SMD 0.44 1.74 (0.325 -2.8) (0.975 -2.8) (1.625 -2.8) (2.275 -2.8)

(2.925 -2.8) (3.575 -2.8) (4.225 -2.8) (4.875 -2.8) (5.525 -2.8) (6.175

-2.8) (6.825 -2.8) (7.475 -2.8);

 

  1. Lower row

SMD 0.44 1.74 (0.325 2.8) (0.975 2.8) (1.625 2.8) (2.275 2.8) (2.925

2.8) (3.575 2.8) (4.225 2.8) (4.875 2.8) (5.525 2.8) (6.175 2.8) (6.825

2.8) (7.475 2.8);

 

  1. Silkscreen

LAYER tPlace;

WIRE (0 -2.25) (7.90 -2.25) (7.90 2.25) (0 2.25) (0 -2.25);

 

 

STEP 4: I run the file .scr and y then I have the next footprint:

 

 

 

There are a couple of things that I still have to solve:

 

- How do I change the solder mask for the thermal pad? According to the

datasheet, I should let a small "windows" as shown in the first picture.

 

- The vias are still pending.

 

Thanks in advance!

--

Web access to CadSoft support forums at www.eaglecentral.ca.  Where the CadSoft EAGLE community meets.

 

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  • esilviu
    esilviu over 15 years ago

     

    "humano" <humanoc@hotmail.com> wrote in message

    news:hsehp5$vdn$1@cheetah.cadsoft.de...

    Hi people, i am new here.

     

    I want to create a library for the TI tlc5927. It has a lot of

    connections,

    so I decided to learn to use the command line: SMD, PAD, etc.

     

    I explain step by step what I've done.

     

    Component's datasheet:

    http://focus.ti.com/docs/prod/folders/print/tlc5927.html

     

    STEP 1: Read the datasheet and look for the information about the pins,

    measures, recommended footprint, etc. I have marked in red the information

    that I use.

     

     

    What I need are the dimmensions of the pads and the big thermal pad (in

    red).

     

    STEP 2: Calculate the relative positions of every pad referring to the

    origin (blue cross in the picture). I use a excel sheet to calculate

    easily

    the position of every pad, like:

     

     

    STEP 3: With this Information I prepare a file .scr that will create the

    footprint automatically.

     

    Quote:

    1. Thermal pad

    SMD 7.8 3.4 (3.9 0);

     

    1. Upper row

    SMD 0.44 1.74 (0.325 -2.8) (0.975 -2.8) (1.625 -2.8) (2.275 -2.8)

    (2.925 -2.8) (3.575 -2.8) (4.225 -2.8) (4.875 -2.8) (5.525 -2.8) (6.175

    -2.8) (6.825 -2.8) (7.475 -2.8);

     

    1. Lower row

    SMD 0.44 1.74 (0.325 2.8) (0.975 2.8) (1.625 2.8) (2.275 2.8) (2.925

    2.8) (3.575 2.8) (4.225 2.8) (4.875 2.8) (5.525 2.8) (6.175 2.8) (6.825

    2.8) (7.475 2.8);

     

    1. Silkscreen

    LAYER tPlace;

    WIRE (0 -2.25) (7.90 -2.25) (7.90 2.25) (0 2.25) (0 -2.25);

     

    STEP 4: I run the file .scr and y then I have the next footprint:

     

     

     

    There are a couple of things that I still have to solve:

     

    - How do I change the solder mask for the thermal pad? According to the

    datasheet, I should let a small "windows" as shown in the first picture.

     

    - The vias are still pending.

     

    Thanks in advance!

    --

    Web access to CadSoft support forums at www.eaglecentral.ca.  Where the

    CadSoft EAGLE community meets.

     

     

    If you adjust grid to help you, that footprint could be ready in 5min.

     

     

     

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Reply
  • esilviu
    esilviu over 15 years ago

     

    "humano" <humanoc@hotmail.com> wrote in message

    news:hsehp5$vdn$1@cheetah.cadsoft.de...

    Hi people, i am new here.

     

    I want to create a library for the TI tlc5927. It has a lot of

    connections,

    so I decided to learn to use the command line: SMD, PAD, etc.

     

    I explain step by step what I've done.

     

    Component's datasheet:

    http://focus.ti.com/docs/prod/folders/print/tlc5927.html

     

    STEP 1: Read the datasheet and look for the information about the pins,

    measures, recommended footprint, etc. I have marked in red the information

    that I use.

     

     

    What I need are the dimmensions of the pads and the big thermal pad (in

    red).

     

    STEP 2: Calculate the relative positions of every pad referring to the

    origin (blue cross in the picture). I use a excel sheet to calculate

    easily

    the position of every pad, like:

     

     

    STEP 3: With this Information I prepare a file .scr that will create the

    footprint automatically.

     

    Quote:

    1. Thermal pad

    SMD 7.8 3.4 (3.9 0);

     

    1. Upper row

    SMD 0.44 1.74 (0.325 -2.8) (0.975 -2.8) (1.625 -2.8) (2.275 -2.8)

    (2.925 -2.8) (3.575 -2.8) (4.225 -2.8) (4.875 -2.8) (5.525 -2.8) (6.175

    -2.8) (6.825 -2.8) (7.475 -2.8);

     

    1. Lower row

    SMD 0.44 1.74 (0.325 2.8) (0.975 2.8) (1.625 2.8) (2.275 2.8) (2.925

    2.8) (3.575 2.8) (4.225 2.8) (4.875 2.8) (5.525 2.8) (6.175 2.8) (6.825

    2.8) (7.475 2.8);

     

    1. Silkscreen

    LAYER tPlace;

    WIRE (0 -2.25) (7.90 -2.25) (7.90 2.25) (0 2.25) (0 -2.25);

     

    STEP 4: I run the file .scr and y then I have the next footprint:

     

     

     

    There are a couple of things that I still have to solve:

     

    - How do I change the solder mask for the thermal pad? According to the

    datasheet, I should let a small "windows" as shown in the first picture.

     

    - The vias are still pending.

     

    Thanks in advance!

    --

    Web access to CadSoft support forums at www.eaglecentral.ca.  Where the

    CadSoft EAGLE community meets.

     

     

    If you adjust grid to help you, that footprint could be ready in 5min.

     

     

     

    • Cancel
    • Vote Up 0 Vote Down
    • Sign in to reply
    • Cancel
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