My layout allows smds overlapping the rest-ring on vias, but I don't
want any drill inside (or near) smds.
In DRC, I set smd-via for same signals to 0, but this also seems to
allow drills in the middle of a smd wich is normally bad (*). I think
this behaviour should change or improve. In the future, maybe a checkbox
to select if this clearance is measured from the drill perimeter or the
via/pad perimeter.
(*) To support this, the via's need to be copper filled and this may be
an expensive process that you normally don't want. Maybe a future Eagle
should allow this as a special option.
