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Have a question about CadSoft EAGLE?  Ask our Expert, Richard! (Archive)

nlarson

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Richard Hammerl

Richard is an engineer with 16 years experience in EAGLE customer support and is waiting for your questions.

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  • Hi Richard,

     

    in order to reduce crosstalk and ground bounce, it is a good practice to connect every single GND pin of SMD components with its own via to an underneath GND area or layer. For example, it should be avoided that the GND pin of an IC and the GND pad of a nearby decoupling capacitor share the same via to connect to the GND area (on the bottom layer or an internal layer).

     

    In section 7.12 of the EAGLE manual, some hints are given on how to configure the autorouter in similar situations, but I could not find any reference on how to force it to use a separate via for each GND connection.

     

    Could you please suggest how this can be obtained?

     

    Thank you very much!

  • in reply to e14 Contributor

    Hi magooo,

     

    sorry for my late reply......

    Take a look at the mnSegments parameter. If you set it to 2, I think it should be okay. The autorouter is allowed to use two wire segments for a connection. It needs one segment to jump from the middle of the SMD to a grid point and one segment to come out of the SMD. Then it will set a via to connect to the inner ground plain. Maybe you try values from1..3 for this.

     

    HTH

    Regards,

    Richard

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  • in reply to e14 Contributor

    Hi magooo,

     

    sorry for my late reply......

    Take a look at the mnSegments parameter. If you set it to 2, I think it should be okay. The autorouter is allowed to use two wire segments for a connection. It needs one segment to jump from the middle of the SMD to a grid point and one segment to come out of the SMD. Then it will set a via to connect to the inner ground plain. Maybe you try values from1..3 for this.

     

    HTH

    Regards,

    Richard

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