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Have a question about CadSoft EAGLE?  Ask our Expert, Richard! (Archive)

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Richard Hammerl

Richard is an engineer with 16 years experience in EAGLE customer support and is waiting for your questions.

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  • Hi Richard,

     

    I´ve got a doubt making the gerber files:

     

    You can only place a pad in the package libraries and you can only insert the vias in the board layout. The difference between them is that a pad must be covered with cooper to join it to another track, so it must avoid the "cream frame " (green layer to protect/isolate the board), and the via don´t need that. But when I see (in the came processor) the different gerber files , specially the solder stop mask and the cream frame (layers 29,30,31,32) there is no difference between a pad and a via.

     

    Regards,

     

    Xabi

  • in reply to e14 Contributor

    Hi Xabi,

    you wrote:

    But when I see (in the came processor) the different gerber files ,  specially the solder stop mask and the cream frame (layers 29,30,31,32)  there is no difference between a pad and a via.

    Layer 29 and 30 contain information about the solder stop mask. Each pad and smd and via will be free of lacquer by default. You can change this and have vias covered as well. (==> Design Rules, Mask tab, Limit).

    Layer 31 and 32 contain information about the cream frame or solder paste mask. This on is defined for SMDs only. No pad or vias needs a solder paste.

    All these is generated automatically, if you did not set this off and defined your own solder stop mask od cream frame.

     

    Regards,

    Richard

Reply
  • in reply to e14 Contributor

    Hi Xabi,

    you wrote:

    But when I see (in the came processor) the different gerber files ,  specially the solder stop mask and the cream frame (layers 29,30,31,32)  there is no difference between a pad and a via.

    Layer 29 and 30 contain information about the solder stop mask. Each pad and smd and via will be free of lacquer by default. You can change this and have vias covered as well. (==> Design Rules, Mask tab, Limit).

    Layer 31 and 32 contain information about the cream frame or solder paste mask. This on is defined for SMDs only. No pad or vias needs a solder paste.

    All these is generated automatically, if you did not set this off and defined your own solder stop mask od cream frame.

     

    Regards,

    Richard

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