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Autodesk EAGLE
Forum Have a question about CadSoft EAGLE?  Ask our Expert, Richard! (Archive)
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Have a question about CadSoft EAGLE?  Ask our Expert, Richard! (Archive)

nlarson
nlarson over 16 years ago

This thread is now locked - but you can still ask Richard by posting your questions here.  If you'd rather browse other member's questions you can read the CadSoft EAGLE Forums for past questions and answers. Enjoy!

 

Browse past Q&A help on anything technical relating to CadSoft EAGLE!


image

 

Richard Hammerl

Richard is an engineer with 16 years experience in EAGLE customer support and is waiting for your questions.

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  • e14 Contributor
    e14 Contributor over 15 years ago


    Hello Eagle experts,

    I want to use a CR2032 coin cell to power a circuit and am planning on using a simple eagle plastic metal battery clip to attach the battery to the PCB.

     

    The question is how to best create the part in Eagle.

    The vias for the positive power and mechanical connection of the clip  seem easy enough. I just have to position and size them correctly.

    The question is how to handle the negative side, since the battery just presses against the PCB. I could create a pad, but that's limited in size.

    I'm concerned that I need to stop the solder mask over the entire region to avoid the battery sitting above the pad on the solder mask. I could

    do that with a polygon in the bstop layer, but is that the right way?  I'd also need to avoid signal lines under the clip, which I can do wih hand routing.

     

    Is there a standard way to do this? I guess this is half an Eagle question and half a PCB fab question, but it seems like the right place to ask.

    Thanks

     


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  • e14 Contributor
    e14 Contributor over 15 years ago in reply to e14 Contributor

    I believe you mean this one or like?

    http://se.mouser.com/images/linxtechnologies/images/Bat%20Holder%20angle.jpg

    I am also interested then. Solved by filled circle above the pad on Top layer (1), but the DRC complains every time.

     

    Another issue is that you have two positive pads,  called them @left and @right in component manager, so they are same,  unfortunately, Eagle wants to draw a signal between those on PCB (always  airwire). How did you solved that situation one pin - two pads (or reverse)?

     

    You can avoid routes by Restrict layers ar avoid components by Keepout.

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  • e14 Contributor
    e14 Contributor over 15 years ago in reply to e14 Contributor

    I'm using the through hole version, but yes, that's the same piece.

     

    I called my pads pos@1 and pos@2 in the package and then just connected one of them up to my symbol in the device. All my positive connections are connected to the one pad, but there's no additional signal between the two pads on the board.

     

    Right I could use restrict and keepout. That makes sense. I just hand routed and positioned things so it wasn't a problem.

     

    I'm most concerned about the 12 mm pad that's in the middle of the 20mm coin cell. That means there's laquer (solder mask) surrounding the pad under the battery. It seems like it might prevent the battery from touching the pad. I'd had to have to melt solder on the pad just to nudge it up. I guess if I did have to do that I'd also want to shrink the pad to make soldering it easier. No point heating that big an area.

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  • Richard_H
    Richard_H over 15 years ago in reply to e14 Contributor

    Hi Daryl,


    I'm most concerned about the 12 mm pad that's in the middle of the 20mm coin cell. That means there's laquer (solder mask) surrounding the pad under the battery. It seems like it might prevent the battery from touching the pad. I'd had to have to melt solder on the pad just to nudge it up. I guess if I did have to do that I'd also want to shrink the pad to make soldering it easier. No point heating that big an area.

     

    You can draw the laquer-free area directly in layer 29 tStop. Use for example a fille circle (width = 0) to draw the solder stop mask.

     

    Regards,

    Richard

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  • Richard_H
    Richard_H over 15 years ago in reply to e14 Contributor

    Hi Daryl,


    I'm most concerned about the 12 mm pad that's in the middle of the 20mm coin cell. That means there's laquer (solder mask) surrounding the pad under the battery. It seems like it might prevent the battery from touching the pad. I'd had to have to melt solder on the pad just to nudge it up. I guess if I did have to do that I'd also want to shrink the pad to make soldering it easier. No point heating that big an area.

     

    You can draw the laquer-free area directly in layer 29 tStop. Use for example a fille circle (width = 0) to draw the solder stop mask.

     

    Regards,

    Richard

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