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Basic Question about connecting a trace to a VIA

Anonymous-715927

I know this is a simple question but when I google things like "connect via to trace" or "increase via connection width" I just get articles going in depth into vias or traces, maybe I just dont have the correct key words yet.

 

By default in eagle (and most layout tools) I have been getting a little cross when I connect to VIAs like this:

image

Here pin 6 is connected to a poly fill (bot layer) but instead of connecting around the whole VIA i get this cross of traces.

 

My question is what do I need to do to have that poly fill on the bottom layer connect around the whole circumference of the VIA pad.

 

Thanks in advance,

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    The effect that you are seeing is called a 'thermal'.  These are typically used to make it easier to solder the pins on a device.  By creating this small 'cross', the pin is slightly isolated thermally, so the soldering iron does not have to heat up the whole plane.  Electrically these thermals are not typically a problem (no significant increase in resistance).  To suppress thermals on a given polygon, you can use the property tool and click on the desired polygon.  On the property window that pops up, about 2/3 of the way down is a check box (Thermals) which you can deselect.  Once you say OK, the popup will close and so will all of the thermals on that polygon.

     

    Good luck!

  • 0 in reply to genebren

    Thanks for the response, I was missing the "thermal" keyword. I also did not really know what the point of them were until now, so helpful info!  There is a board we use at work that consistently gets little brown spots in between a group of solder pads that are without these thermals so the effect is pretty clear to me now.

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