Infineon's new Smart modules are designed for more cost-effective and compact inverter designs by simplifying the mounting process and increasing reliability. The Smart modules combine PressFIT technology with a sophisticated housing concept.
Their new duplex frames achieve a very high level of reliability during the mounting process and subsequent operation. The PressFIT pin is connected to the PCB, the PCB is stabilized and the module is mounted on the heatsink in one single step.
The Smart1 package supports current ratings up to 75 A in Pack and 35 A in PIM configurations at 600 V and 1200 V.
With their self-acting PressFIT assembly and the benefits of PressFIT technology, these new-generation Smart modules raise the bar for cost-efficient designs.
| Features | Applications |
|
|
