Pansonic has launched Industry Smallest (*1) CSP type Schottky Barrier Diodes
with key characteristics, such as Ultra Small Packaging, High Power and High Heat Dissipation, and Higher Efficiency
with less Voltage Loss, suitable for Power Circuits in Mobile applications.
As electronics products continue to go smaller, thinner and lighter,
board sizes also have the same size limitations, resulting in extremely dense circuit designs.
Therefore, downsizing all components are a must and thermal management has become an even more important factor in board designs.
Also, despite the limited space, the power supply circuit has even more loads with constantly growing data-communications
and High-end High-tech functions.
To solve these issues, Panasonic is announcing a new CSP Diode series, with features such as Ultra-small packaging. (0.6mm x 0.3mm), Industry top-level Low Forward Voltage (15% reduction), and Industry top-level thermal performance (33% heat reduction) .
This series has a line-up of 16 parts to fit all customer designs and requirements.
|Product||Schottky Barrier Diode|
|Series||DB2G series||DB2L series||DB2M series|
|VR/VF||20 to 40V/1A||12 to 30V/0.5A||12 to 20V/0.2A|
|Package size||1.0 x 0.6 x 0.1mm||0.6 x 0.3 x 0.1mm||0.4 x 0.2 x 0.1mm|
- 1. Achieved 0.5A(IF) with Industry Smallest Package size (*1)
|<Package size>||SMT area||:||0.18mm2||86% reduction (*2)|
|Height||:||0.10mm||83% reduction (*2)|
|Volume||:||0.018mm3||98% reduction (*2)|
- 2. Achieved Industry Top Level low VF (*3)
|<VF characteristic>||:||0.39V（0.5A Typ）||15% reduction (*2)|
- 3. Industry Top level Heat Dissipation characteristics (*3)
|<Heat Dissipation>||Junction temp||:||80.9 ℃ 33% reduction (*2)|
- (conditions: 0.5A, outside temp 25 deg.c)
*1 As a Schottky with Max current of 0.5A ( 1A, 0.2A part also industry smallest)、as of Mar., 12th, 2013
*2: In comparison to Panasonic DB2S20900L.
*3: For a 0603 size Schottky Barrier Diode, As of Mar., 12th, 2013
For furtehr information, please contact me or visit our website.