Signal Integrity: impedance matching in combination with BGA fan-out
Higher transfer rates and clock frequencies require impedance matched lines throughout the whole signal path. This is the only way to ensure a failure-free communication between the components. In particular, fine pitch BGAs require complex layer stack-ups and also limit the choice of design parameters.
In this webinar we will show you:
- Solutions for all common BGAs - from standard to fine pitch
- Various stack-up possibilities
- The differences between standard technology and HDI to show typical impedances in combination with complex BGA designs
- The best fitting aspect ratio and the possible via sizes for various BGAs
Deutsch - September 01, 2015, 09:30 (CEST)
Hier zu diesem Webinar anmelden!
English - September 01, 2015, 11:00 (CEST)
