Should be possible to solder with a stencil and a lot of heat. The PCB itself would be pricey with via in pad required and capped/filled vias recommended.
I have seen some amazing self-centering action with regular QFNs. As long as you drop the part less than 1/2 pad off center, you are pretty much golden. Easy talking, I know...
Edit: I just noticed th larger pads in the corners, they help a lot to move the part when the solder is melted.
