I'd be interested to know your thoughts - 2.54mm pitch connectors are still used widespread throughout the industry and 1.27mm pitch is extremely popular but what are the future trends?
I'd be interested to know your thoughts - 2.54mm pitch connectors are still used widespread throughout the industry and 1.27mm pitch is extremely popular but what are the future trends?
The answer to this depends on the density of contacts required. Typically US supplied contacts are on 0.1", 0.05", 0.025" pitches, in Europe we use 2.0, 1.0, 0.5mm pitches.Often we are restricted in the anount of space available for a connector but we have to connect 'n' contacts. If we can get away with it a 1mm contact pitch is easier to design and manufacture the PCB. However if space is tight and more contacts are required we have to go to 0.5mm pitch. The PCB congestion can be relieved by having more than 1 row which can be staggered. The PCB design is still possible but more layers are required to get the connections. CoreTest Technologies www.coretest.co.uk provide board-to-board and flex-to-board connections from 1.27mm pitch down to 0.1mm with very high performance. Data rates of 50Gbit/s are achieved by using differential pairs in a high speed flex. The RF bandwidth achievable is DC to 60GHz -1dB and it operates up to 108GHz at -50 to +150deg C. High quality low frequency and DC connections are also attained due to the <20milli Ohm contact resistance and low L & C. Contacts are separable many 1000's of times. IC Test sockets are also available. I hope goes someway to answer your question, in my experience it depends on the contact density required.
The answer to this depends on the density of contacts required. Typically US supplied contacts are on 0.1", 0.05", 0.025" pitches, in Europe we use 2.0, 1.0, 0.5mm pitches.Often we are restricted in the anount of space available for a connector but we have to connect 'n' contacts. If we can get away with it a 1mm contact pitch is easier to design and manufacture the PCB. However if space is tight and more contacts are required we have to go to 0.5mm pitch. The PCB congestion can be relieved by having more than 1 row which can be staggered. The PCB design is still possible but more layers are required to get the connections. CoreTest Technologies www.coretest.co.uk provide board-to-board and flex-to-board connections from 1.27mm pitch down to 0.1mm with very high performance. Data rates of 50Gbit/s are achieved by using differential pairs in a high speed flex. The RF bandwidth achievable is DC to 60GHz -1dB and it operates up to 108GHz at -50 to +150deg C. High quality low frequency and DC connections are also attained due to the <20milli Ohm contact resistance and low L & C. Contacts are separable many 1000's of times. IC Test sockets are also available. I hope goes someway to answer your question, in my experience it depends on the contact density required.