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Ask an Expert Forum Have a question about signal or power integrity? Ask our Expert - Dr. Eric Bogatin
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Have a question about signal or power integrity? Ask our Expert - Dr. Eric Bogatin

ChristyZ
ChristyZ over 16 years ago

This thread has been closed to new questions.

However, we welcome you to Post Your Question about Communications in the element14 Community Wireless Communications Technology group. You'll find many fellow members and experts who have just the answer you're looking to find! 

 

Thank You, Your Friends at element14 Community

 

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Eric Bogatin

Dr. Eric Bogatin received his BS degree in physics from MIT, and MS and PhD degrees in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft, and Interconnect Devices. Eric has written four books on signal integrity and interconnect design and over 200 papers. He has taught over 4,000 engineers in the last 20 years.



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  • Former Member
    Former Member over 15 years ago

    Other choices did not seem to fit, so ...

     

    I wish to program Nordic Semiconductor 24le1 chip in assembly language.  Manufacturer doesn't have help in this respect, as all their examples are in 'c'.  Can you point me to a source/examples on this?

     

    Thanks,

    John Johnson

    john@ja-johnson.com

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  • nickgray
    nickgray over 15 years ago in reply to Former Member

    As a suggestion, I think this question should have been under the Embedded Design Group. If you post it there you might get a better response thank I can give you.

     

    Since this Nordic Semi device uses an 8051 core, the assembly language will undoubtedly be mostly the same as for the 8051. However, because this device has other functions, there will be more commands than those of the 8051 itself. Since Nordic apparently did not see fit to publish its assembly language commands, I suggest you contact them and ask for an Programming Applications Engineer for the device. See the "Contact Us" link on their web page.

     

    Good luck!

     

    - Nick Gray

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  • Former Member
    Former Member over 15 years ago

    Dr. Bogatin,

     

    I'm looking at your Ph.D in Physics from Tuscon as the expert for my Relative Humidity Electronics Question.

     

    I've noticed that Dell Computer has a Relative Humidity specification from 20% to 80% (noncondensing) on their Mini Tower Computer Specification (OptiPlex 755).   At 100% RH things can get wet and thus short.  But why the low limit at 20%.  Things can get dry here in Colorado, even lower than 20%.  Does this mean Honeywell should not buy Dell computers?  (I find this hard to believe since I have operated a Dell at home for the past 11 years here without any consideration for Relative Humidity.)   I've called Dell and talked to 5 different departments in New Delhi, India.  They said that 20-80% is the operating range, but can tell me nothing else.  (One tech told me that the computer would not cool down if RH was below 20%.)

     

    I would have thought that the dryer the better.  Oh yes,  ESD is more of a problem, but isn't this a problem when one goes to service the equipment, which means the computer is not in the "operational mode."  But should this even be called a problem if my company has proper ESD procedures in place to service the equipment.

     

    Question: Why should any electronic device need a low limit on the Relative Humidity specification, considering the case is grounded and thus provides ESD shielding?

     

    Thank you,

     

    Jerry Kelley, PE

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  • Former Member
    Former Member over 14 years ago

    Dr. Bogatin,

     

         I am looking for some guidance and assistance in evaluating a current design issue that I would like to change. 

     

         Currently we utilize a four layer mixed signal board design, that has split ground plane, and power source islands internal to the signal layers.  What I am looking at is the feasibility of isolating the transmit section with an air mote and moving it to a 2 layer PCB that sits inside a cutout section of the main PCB.  With the non-integrated transmit section this would allow me the time to re-design transmitter sections to work with older systems that we currently have in the field.  We manufacture Pulsed Eddy Current Tramp Metal Detectors for industrial applications.  I would like to know if the design is worthy of being a means to reduce noise caused along the split ground plane that shows in the receiver post processing section, and also if the introduction of a signal bridge for system monitoring and transmit pulse initiation would create excessive noise within the design. 

     

         My initial thoughts are that with the isolation is that it would greatly reduce the noise felt on the ground plane in the multi layer board and also having the transmit pulse developed and sent down a "Moated" section reducing the noise from those runs.  I have pictures of what the board would look like with the air moat around the transmit section and also what the current design along with the receiver signal processing section looks like to be able to visualize the design concept. 

     

    Any guidance or assistance you can provide is greatly appreciated.

     

    Mike Burr

    R&D Engineer.

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  • Former Member
    Former Member over 14 years ago

    Hello,

     

    I am a computer and electronics recycler.  If you wouldn't mind sharing a connection with someone who knows a great deal about porcelean and gold chips it would be greatly appreciated.   I cam eaccross s me dinosaurs.

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  • Former Member
    Former Member over 13 years ago

    Dear Dr Bogatin,

     

    Of all the experts listed, I hope that you are the one that might be able to help me.

    We have an intruder alarm system that monitors the temperature of -80 deg C freezers in a room that is shared by three departments.  If any freezer rises above a certain danger level, the alarm trips and phones a mobile number with the message “alarm activation in freezer room”.  It gives no other information.  This means the phone holder has to attend the freezer room and either get the freezer back down to temperature or transfer specimens to another backup freezer.

     

    We wish to upgrade the system to one that has approximately 12-15 zones that can be split into 3 distinct areas which are associated with a phone number each.  The idea being that when an alarm trips, in a specific area, the correct number is dialled thus alerting the correct department.  I have looked through various manuals and it is not clear if any systems will do this.  Would you be able to enlighten me regarding this.

     

    Thank you in anticipation.

     

    Regards

     

    Graham Palmer

     

    This thread has been closed to new questions.

    However, we welcome you to Post Your Question about Communications in the element14 Community Wireless Communications Technology group. You'll find many fellow members and experts who have just the answer you're looking to find! 

     

    Thank You, Your Friends at element14 Community

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