Have a question about signal or power integrity? Ask our Expert - Dr. Eric Bogatin

Dr. Bogatin,

     I am looking for some guidance and assistance in evaluating a current design issue that I would like to change. 

     Currently we utilize a four layer mixed signal board design, that has split ground plane, and power source islands internal to the signal layers.  What I am looking at is the feasibility of isolating the transmit section with an air mote and moving it to a 2 layer PCB that sits inside a cutout section of the main PCB.  With the non-integrated transmit section this would allow me the time to re-design transmitter sections to work with older systems that we currently have in the field.  We manufacture Pulsed Eddy Current Tramp Metal Detectors for industrial applications.  I would like to know if the design is worthy of being a means to reduce noise caused along the split ground plane that shows in the receiver post processing section, and also if the introduction of a signal bridge for system monitoring and transmit pulse initiation would create excessive noise within the design. 

     My initial thoughts are that with the isolation is that it would greatly reduce the noise felt on the ground plane in the multi layer board and also having the transmit pulse developed and sent down a "Moated" section reducing the noise from those runs.  I have pictures of what the board would look like with the air moat around the transmit section and also what the current design along with the receiver signal processing section looks like to be able to visualize the design concept. 

Any guidance or assistance you can provide is greatly appreciated.

Mike Burr

R&D Engineer.

Dr. Bogatin,

     I am looking for some guidance and assistance in evaluating a current design issue that I would like to change. 

     Currently we utilize a four layer mixed signal board design, that has split ground plane, and power source islands internal to the signal layers.  What I am looking at is the feasibility of isolating the transmit section with an air mote and moving it to a 2 layer PCB that sits inside a cutout section of the main PCB.  With the non-integrated transmit section this would allow me the time to re-design transmitter sections to work with older systems that we currently have in the field.  We manufacture Pulsed Eddy Current Tramp Metal Detectors for industrial applications.  I would like to know if the design is worthy of being a means to reduce noise caused along the split ground plane that shows in the receiver post processing section, and also if the introduction of a signal bridge for system monitoring and transmit pulse initiation would create excessive noise within the design. 

     My initial thoughts are that with the isolation is that it would greatly reduce the noise felt on the ground plane in the multi layer board and also having the transmit pulse developed and sent down a "Moated" section reducing the noise from those runs.  I have pictures of what the board would look like with the air moat around the transmit section and also what the current design along with the receiver signal processing section looks like to be able to visualize the design concept. 

Any guidance or assistance you can provide is greatly appreciated.

Mike Burr

R&D Engineer.