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Heatsink usage

Andrew J

Specifically, this heatsink: Fischer Elektronik LA6/150 12VFischer Elektronik LA6/150 12V.  I'm trying to work out how that might be used so I'm putting it out there to see if anyone has used something like it or have ideas.  From what I can tell, it 'seems' to be used with a removable bottom plate for 'flat' semiconductors but I'm thinking that something like, say, a TO220 package could be attached to the side with a self-tapper.  A bit like they show with their LAM series heatsinks (PDF, sorry for the non-Farnell link!): here they show them with transistors 'clipped' to the side on the K version so I'd assume that on the non-K version, one would just screw it on.  What think you lot?

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  • For use with a TO220 package device, the LA6/150 12V heatsink would be an overkill and expensive too. From what I have seen, this type heatsinks are used on SMD ICs like processors or FPGAs. Basically on devices that can get quite hot. If you have multiple TO220 packages for example incase of inverter circuits or any other power electronics circuits, then I think it's feasible to use and yes drilling and hole and screwing the TO220 in the LA6/150 is fine. I have used simple aluminum from the waste material of frames for french windows in my house. They work fine as a heat sink.

  • in reply to rsjawale24

    I Was more interested in sussing out how that series worked and whether the design intrinsically required the IC to be attached to the bottom 1.2mm plate or not.  Have you used one or, like me, looked at it and thought that devices could be attached to the side: it certainly looks feasible.

  • in reply to Andrew J

    Hi Andrew,

    I remember a little from my thermodynamics classes that there are special materials/coatings that will have high thermal conductivity/capacity. I'm not sure if these heat sinks have that or work uniformly from all side (device attached to any of the four side) but the inner fin structure seems to be an important parameter to decide on which side the device should be mounted.

  • in reply to Andrew J

    I would second the suggestion to have parallel semiconductors. Usually TO-220, I wouldn't want to be doing more than about 50W/package mainly because of the Rjc. You don't want to get anywhere near the maximum junction temperature, as the safe operating area may require cutting dissipation significantly as temperature increases and there is always the risk of a high ambient, declining heatsink efficiency due to dust accumulation ...

     

    There's usually no great downside to having things run cooler than expected ... it should mean longer device lifetimes and some tolerance for accidental overloads.

     

    - Gough

  • in reply to Andrew J

    If cost is the driver, then 's suggestion is in many cases going to be the way to go.

    For some units (niche products), the price is not the driver. It may be performance, size, or the requirement to use particular power device.

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