Evaluation Kit for MPC8309 Processor
The NXP's MPC8309-KIT evaluation kit (MPC8309-KIT) is a cost-optimized reference design board for NXP’s MPC8309-KIT PowerQUICC II Pro processors, built on Power Architecture® technology. The kit consists of a carrier card and a system on module (SOM) representing each of the two processors.
The NXP's MPC8309-KIT can be customized per project and combined with off-the-shelf software for product development. The module components provide the tools, device drivers and additional features needed for embedded Linux® OS projects. The MPC8309-KIT incorporates the e300c3 (MPC603e-based) core built on Power Architecture® technology, which includes 16 Kbytes of each L1 instruction and data caches, dual integer units, and on-chip memory management units (MMUs). The MPC8309 also includes a 32-bit PCI controller, two DMA engines and a 16/32-bit DDR2 memory controller with 8-bit ECC.
A new communications complex based on QUICC Engine technology forms the heart of the networking capability of the MPC8309-KIT. The QUICC Engine block contains several peripheral controllers and a 32-bit RISC controller. Protocol support is provided by the main workhorses of the device - the unified communication controllers (UCCs). Each of the five UCCs can support a variety of communication protocols such as 10/100 Mbps MII/RMII Ethernet, HDLC and TDM.
In summary, the MPC8309-KIT provides users with a highly integrated, fully programmable communications processor. This helps to ensure that a low-cost system solution can be quickly developed and offers flexibility to accommodate new standards and evolving system requirements.
Key Applications: Network communication, Low-end printers, Factory or building automation, IEEE® 1588 in test and measurement equipment and industrial automation, Programmable logic controller, Managed industrial router
Features
- CPU: MPC8309-KIT PowerQUICC II Pro
- CPU Frequency Supported on SOM: 266/333 MHz
- Memory Subsystem
- 256 MB DDR2 SDRAM
- 8 MB NOR flash memory
- 512 MB NAND flash memory
- 256 KB serial EEPROM
- Ethernet: 3 x 10/100 MII/RMII
- One USB 2.0
- One eSDHC (microSD)
- Two UART
- Two I2C
- One Flexcan
- Connectors—SOM
- 3-pin power jack
- 3-pin UART header for console
- JTAG/COP for debug
- 120-pin and 140-pin board-to-board connector
- 6-pin BDM header for KA2 programming
- RJ-45 for Ethernet
- microSD card
- 6-pin header for boot device (NAND/NOR) selection
- Connectors—Carrier Board
- PCI card edge connector
- Mini PCI card edge connector
- Dual stack DB9 connector for RS-232 console and RS-485
- RJ45 connector for T1/E1
- RJ45 connector for FEC-3
- MiniAB USB
- Microcontroller UART header
- Microcontroller BDM header
- 4-pin CAN header
- RJ-11 for SLIC/PSTN phone interface
- 60-pin local bus
- 120-pin and 140-pin board-to-board connector
- 16-pin SPI and IEEE 1588 header
- 16-pin GPIO header
- Form Factor—SOM: 90 mm x 70 mm
- Form Factor—Carrier Board: 170 mm x 170 mm
Ships With
- MPC8309-KIT SOM board
- MPC830X carrier card
- Two UART cable
- Ethernet cable
- Power adaptor (12V, 5A) and cable
- User guide
- Linux® BSP and drivers
- CD of Code Warrior tools for Power Architecture technology