I've got a PCB with a fair number of sensitive analog parts on it so I've
flooded a large area of the top layer of the board with a copper ground
plane using the Polygon feature of Eagle. Another large section of the
board has been left without the top layer copper plane. All is OK with this
and the PCB is about ready to manufacture.
It occurred to me that this could be problematic in the PCB manufacturing
process. Having half the board covered with copper where the traces are
isolated by a narrow gap and then the other half with narrow traces and all
the surrounding copper removed could present problems for the etching
On the other hand, removing less copper by leaving large copper pours should
be more environmentally friendly.
Do PCB manufacturers have a preference one way or the other? (I've checked
a number of PCB vendors websites and haven't really found any information.)