When designing an SMD package with the library editor, the size of the
solderstop window as well as the size of the solder cream window are
generated automatically based on the size of the pad. By default, the
solderstop is slightly larger than the copper pad and the soldercream is
identical to the copper pad (at least in version 4.11 that I'm still using).
I have looked for a way to change these default setting but couldn't find
any setting or preference to do so. Now, here are my questions :
- is there a way to modify the over- or undersize of soldercream with
respect to the copper pad?
- if not, can I set the pads to "NOCREAM" and manually draw a
rectangle/polygon on the respective cream layer to have a cream pattern with
a specific oversize (or undersize) with respect to the copper pad's
Thanks in advance,