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SMD Pads

autodeskguest

When designing an SMD package with the library editor, the size of the

solderstop window as well as the size of the solder cream window are

generated automatically based on the size of the pad. By default, the

solderstop is slightly larger than the copper pad and the soldercream is

identical to the copper pad (at least in version 4.11 that I'm still using).

 

I have looked for a way to change these default setting but couldn't find

any setting or preference to do so. Now, here are my questions :

 

- is there a way to modify the over- or undersize of soldercream with

respect to the copper pad?

 

- if not, can I set the pads to "NOCREAM" and manually draw a

rectangle/polygon on the respective cream layer to have a cream pattern with

a specific oversize (or undersize) with respect to the copper pad's

dimensions?

 

Thanks in advance,

 

Robert

 

 

 

 

 

Parents

  • Robert wrote:

    When designing an SMD package with the library editor, the size of the

    solderstop window as well as the size of the solder cream window are

    generated automatically based on the size of the pad. By default, the

    solderstop is slightly larger than the copper pad and the soldercream is

    identical to the copper pad (at least in version 4.11 that I'm still using).

     

    I have looked for a way to change these default setting but couldn't find

    any setting or preference to do so. Now, here are my questions :

     

    - is there a way to modify the over- or undersize of soldercream with

    respect to the copper pad?

     

    Yes, but this is done in the board editor, not the library editor, and

    it applies to all pads in the design. Open up the DRC window and look in

    the Masks tab.

     

    - if not, can I set the pads to "NOCREAM" and manually draw a

    rectangle/polygon on the respective cream layer to have a cream pattern with

    a specific oversize (or undersize) with respect to the copper pad's

    dimensions?

     

    Yes, you can type "set cream off" in the LIBRARY editor (not the board

    editor) and define pads to not have automatically-generated cream then

    draw your own pattern on the tCream layer.

     

    BTW CadSoft, any chance you can rename "cream" to "paste" in the English

    versions? Cream is something we add to our coffee image

     

    Andrew.

     

Reply

  • Robert wrote:

    When designing an SMD package with the library editor, the size of the

    solderstop window as well as the size of the solder cream window are

    generated automatically based on the size of the pad. By default, the

    solderstop is slightly larger than the copper pad and the soldercream is

    identical to the copper pad (at least in version 4.11 that I'm still using).

     

    I have looked for a way to change these default setting but couldn't find

    any setting or preference to do so. Now, here are my questions :

     

    - is there a way to modify the over- or undersize of soldercream with

    respect to the copper pad?

     

    Yes, but this is done in the board editor, not the library editor, and

    it applies to all pads in the design. Open up the DRC window and look in

    the Masks tab.

     

    - if not, can I set the pads to "NOCREAM" and manually draw a

    rectangle/polygon on the respective cream layer to have a cream pattern with

    a specific oversize (or undersize) with respect to the copper pad's

    dimensions?

     

    Yes, you can type "set cream off" in the LIBRARY editor (not the board

    editor) and define pads to not have automatically-generated cream then

    draw your own pattern on the tCream layer.

     

    BTW CadSoft, any chance you can rename "cream" to "paste" in the English

    versions? Cream is something we add to our coffee image

     

    Andrew.

     

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