re:Eagle revisited

Rob wrote:

I hope Eagle will take my criticism hear constructively.

 

 

 

First, I know and use several EDA programs. Each has its odd

characteristics, none is perfect.

 

I come back to Eagle every year or so because it has such promise and

the program I now use is starting to show frayed edges (Circuit Maker

2000 pro) which is a Protel layout basically.

 

About release 4.0 or so, I sent an email to Eagle asking if they

would ever incorporate the ability to manipulate individual pads on a

package while on a board. They said they would but as far as I can

see, never did.

If you have ever used this option and most of my EDAs have it, you'll

realize how handy it is. For instance in Circuit Maker and Electronics

Workbench I can change the size and location of any pad on any

package while it is on a board. If I have two pins on a DIP that

don't have wires attached I can change the size of the pads to give

more clearance for wires passing through the DIP.

 

I can do the same thing on a connector block or a simple three lead

transistor too.

 

Hopefully this has been incorporated in Eagle, although I can't find

any way to do it in the help. If it has pass me a note and I'll

reevaluate the program. If not I'll look at it again next year.

Sorry, but as far as I know this capability still doesn't exist in Eagle V5.

I have often wished for this, as well as the ability to easily change other

details of a package footprint.  Sometimes it's a good thing that Eagle

forces you to go back to fix the library part "properly", but other times

you really just want to be able to do a one-time modification to a

footprint, as in your example.

Add my vote for this ability.

--

Bert Menkveld

Rob wrote:

I hope Eagle will take my criticism hear constructively.

 

 

 

First, I know and use several EDA programs. Each has its odd

characteristics, none is perfect.

 

I come back to Eagle every year or so because it has such promise and

the program I now use is starting to show frayed edges (Circuit Maker

2000 pro) which is a Protel layout basically.

 

About release 4.0 or so, I sent an email to Eagle asking if they

would ever incorporate the ability to manipulate individual pads on a

package while on a board. They said they would but as far as I can

see, never did.

If you have ever used this option and most of my EDAs have it, you'll

realize how handy it is. For instance in Circuit Maker and Electronics

Workbench I can change the size and location of any pad on any

package while it is on a board. If I have two pins on a DIP that

don't have wires attached I can change the size of the pads to give

more clearance for wires passing through the DIP.

 

I can do the same thing on a connector block or a simple three lead

transistor too.

 

Hopefully this has been incorporated in Eagle, although I can't find

any way to do it in the help. If it has pass me a note and I'll

reevaluate the program. If not I'll look at it again next year.

Sorry, but as far as I know this capability still doesn't exist in Eagle V5.

I have often wished for this, as well as the ability to easily change other

details of a package footprint.  Sometimes it's a good thing that Eagle

forces you to go back to fix the library part "properly", but other times

you really just want to be able to do a one-time modification to a

footprint, as in your example.

Add my vote for this ability.

--

Bert Menkveld