Mousebites?

I do this often on 2 layer boards, and all I do is draw the 'mousebites' on Layer 20 - eagle takes care of adjusting the POLYs

I have never tried it on 4 or 6 layer boards though.

Ok, so you draw a line in the dimensionlayer?

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Steen wrote:

Hello Forum.

 

I am making a 6 layer PCB and one part of the circuit is supposed to

be able to physically break off so it can be de-attached. I though it

could be made with 'mousebites' (don't know if it got another name,

but it is just like the areas between the individual PCB's when

panelizing - Example:

http://blogs.oracle.com/spotee/resource/eDAQ_Panel.jpg).

 

My questions is:

 

1. How is this done in Eagle?

2. I have supply-/ground-layers on some inside layers and groundfill

on both top and bottom layers. should I minimize theese aound the

'break-off-area'?

 

Best regards

 

Stg.

 

I  recommend googling "pcb mouse bites" . Many good board house requirements

documents are returned. The variety of their approaches to breakoff and

routing is valuable education.

How you address the requirement in Eagle depends on whether you go with

mouse bites or v-scoring. Board tickness comes into it.

Talk to your board house as their requirements will govern how you do it in

Eagle.

Keep copper well away from the break-line. It makes it harder to break and

ideally you should not expose copper after the break.

You application is internal to your board design so you should be able to

specify your break without being tied to the style of break-offs the board

house panalization utilizes.

HTH

Warren

Thanks Warren. I think I will contact the boardhouse to be sure how it's

done then.

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"Steen" <stg@logos.dk> wrote in message

news:iqteeg$7p5$1@cheetah.cadsoft.de...

Hello Forum.

 

I am making a 6 layer PCB and one part of the circuit is supposed to be

able to physically break off so it can be de-attached. I though it could

be

made with 'mousebites' (don't know if it got another name, but it is just

like the areas between the individual PCB's when panelizing - Example:

http://blogs.oracle.com/spotee/resource/eDAQ_Panel.jpg).

 

My questions is:

 

1. How is this done in Eagle?

2. I have supply-/ground-layers on some inside layers and groundfill on

both top and bottom layers. should I minimize theese aound the

'break-off-area'?

1- This is just done by "milling and drilling". Normally this is done by the

manufacturer and is part of the panelizing process, but if you want to make

panels yourself, you just define the shape by drawing in mill layer, and put

small holes in the perforated tabs. The pick&place manufacturer knows best

what sizes you should use.

2- If you do this with mill and drill, the spacing will be taken care of by

DRC parameters (edge clearance), and tracks will be checked by a DRC.

I think I will contact the boardhouse to be sure how it's

done then.

This is a good approach.

If you are looking for more suggestions there have been at least a

couple of other threads on this topic in these newsgroups where it is

described as a "break away", e.g. :

"Break away rails" 6-Aug-10

I use the (old) IPC-SM-762 fig 3-31 suggestion.  It has always been OK

for me but YMMV.

Regards,

Neil